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PDF PLA110STR Data sheet ( Hoja de datos )
| Número de pieza | PLA110STR | |
| Descripción | Relay | |
| Fabricantes | IXYS | |
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INTEGRATED CIRCUITS DIVISION
PLA110
Single Pole, Normally Open
OptoMOS® Relay
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
400
150
22
Units
VP
mArms / mADC
Features
• 3750Vrms Input to Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• FCC Compatible
• VDE Compatible
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, PocketSize)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Description
PLA110 is a normally open (1-Form-A) solid
state relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation. Its optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
The PLA110 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or thru-hole
package.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
PLA110
PLA110S
PLA110STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
1
+ Control
2
- Control
3
NC
6
Load
5
Do Not Use
4
Load
DC Only Configuration
1
+ Control
2
- Control
3
NC
6
5
4
+ Load
- Load
Pb
DS-PLA110-R07
e3
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
www.ixysic.com
1
1 page  
INTEGRATED CIRCUITS DIVISION
PLA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
PLA110 / PLA110S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
PLA110 / PLA110S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R07 www.ixysic.com
5
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet PLA110STR.PDF ] | |
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