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PDF CPC1014N Data sheet ( Hoja de datos )
| Número de pieza | CPC1014N | |
| Descripción | Normally Open 4-Lead SOP OptoMOS Relay | |
| Fabricantes | IXYS | |
| Logotipo |  |
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
400
2
2
Units
VP
mArms / mADC
mA
Features
• Designed for use in security systems complying
with EN50130-4
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to radiated EM fields
• Wave Solderable
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
CPC1014N
60V, 400mA Normally-Open
Single-Pole 4-Pin SOP Relay
Description
The CPC1014N is a miniature single-pole,
normally-open (1-Form-A) solid state relay in a
4-pin SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input
to output isolation. The super efficient MOSFET
switches and photovoltaic die use IXYS Integrated
Circuits Division’s patented OptoMOS architecture.
The optically coupled output is controlled by a highly
efficient infrared LED.
IXYS Integrated Circuits Division’s state of the art,
double-molded vertical construction packaging makes
the CPC1014N one of the world’s smallest relays.
It offers board space savings over the competitor’s
larger 4-pin SOP relay.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
Ordering Information
Part #
CPC1014N
CPC1014NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
1
+ Control
2
– Control
4
Load
3
Load
Switching Characteristics
of Normally-Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
DS-CPC1014N-R05
www.ixysic.com
1
1 page  
INTEGRATED CIRCUITS DIVISION
CPC1014N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1014N
Moisture Sensitivity Level (MSL) Classification
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
CPC1014N
Classification Temperature (Tc)
260ºC
Dwell Time (tp)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R05 www.ixysic.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1014N.PDF ] | |
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