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PDF TQM969001 Data sheet ( Hoja de datos )

Número de pieza TQM969001
Descripción Filter - PCS Duplexer
Fabricantes TriQuint Semiconductor 
Logotipo TriQuint Semiconductor Logotipo



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No Preview Available ! TQM969001 Hoja de datos, Descripción, Manual

TQM969001
PCS Duplexer
Applications
Coverage enhancement repeaters
Femtocells
Test Mobiles
Product Features
Small form factor of 3.8 X 3.8 mm
Max height of 1.2 mm
Max Uplink/Downlink peak power of 38dBm
Halogen and Lead free construction
3-pin 3.8x3.8mm leadless LGA package
Functional Block Diagram
General Description
TQM969001 is a duplexer designed for US PCS base
station/repeater applications. It exhibits excellent power
handling, pass band flatness, rejection, and
Uplink/Downlink isolation.
The TQM969001 increases the sensitivity and dynamic
range of receivers by providing more than 50 dB
attenuation of the Uplink signal at the receiver input and
more than 50 dB rejection of Uplink-generated noise in the
receiver band.
Typical insertion loss at the Uplink channel is only 1.32 dB
and the typical insertion loss in the Downlink channel is
1.52 dB, which improves the receiver sensitivity.
Pin Configuration
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Pin #
UpLink
DownLink
ANT
name
name
dfdfdfdfdfdfdfdfdfdfdfdfdfff
fffffffffffffffffffffffffffffffffff
fff
Symbol
1
2
3
number
number
<replace with actual pin
numbers>
Ordering Information
Part No.
TQM969001
TQM969001EVB
part number
<replace above with
actual PN’s>
Description
PCS Duplexer
PCS Duplexer evaluation board
evaluation board description
<replace above with product
descriptions as appropriate>
Data Sheet: Rev D 07/12/10
© 2010 TriQuint Semiconductor, Inc.
- 1 of 10-
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/

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TQM969001 pdf
TQM969001
PCS Duplexer
Mechanical Information
The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land
pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company
to company, careful process development is recommended.
Package Outline Drawing:
Top View
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Side View
Data Sheet: Rev D 07/12/10
© 2010 TriQuint Semiconductor, Inc.
- 5 of 10-
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/

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