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PDF SKCD06C060IHD Data sheet ( Hoja de datos )
| Número de pieza | SKCD06C060IHD | |
| Descripción | CAL-DIODE | |
| Fabricantes | Semikron International | |
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SKCD 06 C 060 I HD
CAL-DIODE
IF = 20 A
VRRM = 600 V
Size: 2,44 mm x 2,44 mm
SKCD 06 C 060 I HD
Features
• high current density
• easy paralleling due to a small forward
voltage spread
• positive temperature coefficient
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to standard solder
processes
Typical Applications*
• freewheeling diode for IGBT
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
VRRM
IF(AV)
IFSM
Tjmax
Tj = 25 °C, IR = 0.1 mA
Ts = 80 °C, Tj = 175 °C
10 ms
Tj = 25 °C
sin 180°
Tj = 150 °C
Electrical Characteristics
Symbol Conditions
600 V
16 A
110 A
95 A
175 °C
min. typ. max. Unit
i2t
IR
VF
V(TO)
rT
Tj = 150 °C, 10 ms, sin 180°
Tj = 25 °C, VRRM = 600 V
Tj = 150 °C, VRRM = 600 V
Tj = 25 °C, IF = 12 A
Tj = 150 °C, IF = 12 A
Tj = 150 °C
Tj = 150 °C
45 A2s
0.10 mA
mA
1.35 V
1.31 V
0.85 V
40.0 mΩ
Dynamic Characteristics
Symbol Conditions
min. typ. max. Unit
trr Tj = 25 °C, 9.5 A, 300 V, 150 A/µs
trr Tj = 150 °C, 9.5 A, 300 V, 150 A/µs
Qrr Tj = 25 °C, 9.5 A, 300 V, 150 A/µs
Qrr Tj = 150 °C, 9.5 A, 300 V, 150 A/µs
Irrm Tj = 25 °C, 9.5 A, 300 V, 150 A/µs
Irrm Tj = 150 °C, 9.5 A, 300 V, 150 A/µs
µs
ns
µC
0.93 µC
A
5.2 A
Thermal Characteristics
Symbol Conditions
min. typ. max. Unit
Tj
Tstg
Tsolder
Tsolder
Rth(j-s)
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
-40
-40
2.46
175 °C
175 °C
250 °C
320 °C
K/W
Mechanical Characteristics
Symbol Conditions
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Values
2.44 x 2.44
5.95
bondable (Al)
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
wafer frame
1777 (5" Wafer)
Unit
mm2
mm2
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
1
1 page | ||
| Páginas | Total 2 Páginas | |
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