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PDF LP3984IBPX-3.1 Data sheet ( Hoja de datos )
| Número de pieza | LP3984IBPX-3.1 | |
| Descripción | Micropower/ 150mA Ultra Low-Dropout CMOS Voltage Regulator in Subminiature 4-I/O micro SMD Package | |
| Fabricantes | National Semiconductor | |
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November 2001
LP3984
Micropower, 150mA Ultra Low-Dropout CMOS Voltage
Regulator in Subminiature 4-I/O micro SMD Package
General Description
The LP3984 is designed for portable and wireless applica-
tions with demanding performance and space requirements.
The LP3984’s performance is optimized for battery powered
systems to deliver extremely low dropout voltage and low
quiescent current. Regulator ground current increases only
slightly in dropout, further prolonging the battery life.
Power supply rejection is better than 60 dB at low frequen-
cies and starts to roll off at 10 kHz. High power supply
rejection is maintained down to lower input voltage levels
common to battery operated circuits.
The device is ideal for mobile phone and similar battery
powered wireless applications. It provides up to 150 mA,
from a 2.5V to 6V input, consuming less than 1.2µA in
disable mode and has fast turn-on time less than 20µs.
The LP3984 is available in micro SMD and 5 pin SOT-23
package. Performance is specified for −40˚C to +125˚C
temperature range and is available in 1.5V, 1.8V, 2.0V, and
3.1V output voltages. For other output voltage options from
1.5V to 3.5V, please contact National Semiconductor sales
office.
n 60dB PSRR at 1kHz, 40dB at 10kHz @ 3.1VIN
n ≤1.2µA quiescent current when shut down
n Fast Turn-On time: 20 µs (typ.)
n 75mV typ dropout with 150mA load
n −40 to +125˚C junction temperature range for operation
n 1.5V, 1.8V, 2.0V, and 3.1V
Features
n Miniature 4-I/O micro SMD and SOT-23-5 package
n Logic controlled enable
n Stable with tantalum capacitors
n 1 µF Tantalum output capacitor
n Fast turn-on
n Thermal shutdown and short-circuit current limit
Applications
n CDMA cellular handsets
n Wideband CDMA cellular handsets
n GSM cellular handsets
n Portable information appliances
Key Specifications
n 2.5 to 6.0V input range
n 150mA guaranteed output
Typical Application Circuit
Note: Pin Numbers in parenthesis indicate micro SMD package.
20020402
© 2001 National Semiconductor Corporation DS200204
www.national.com
1 page  
Electrical Characteristics (Continued)
Unless otherwise specified: VIN = 2.5V for 1.5, 1.8, & 2.0V options, VIN = VOUT + 0.5 for output options higher than 2.5V, CIN =
1 µF, IOUT = 1mA, COUT = 1 µF, tantalum. Typical values and limits appearing in standard typeface are for TJ = 25˚C. Limits
appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)
Symbol
Parameter
Conditions
Limit
Typ Units
Min Max
VIL
Maximum Low Level Input
VIN = 2.5 to 6.0V
Voltage at EN
0.4 V
VIH
Minimum High Level Input
VIN = 2.5 to 6.0V
Voltage at EN
1.4 V
COUT
Output Capacitor
Capacitance
ESR
1 22 µF
2 10 Ω
TSD
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
160 ˚C
20 ˚C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Additional information on lead temperature and pad temperature can be found in National Semiconductor Application Note (AN-1112).
Note 4: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula:
PD = (TJ - TA)/θJA,
where TJ is the junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. The 364mW rating for SOT23-5
appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C, for TJ, 70˚C for TA, and 220˚C/W for θJA.
More power can be dissipated safely at ambient temperatures below 70˚C . Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute
Maximum power dissipation for SOT23-5 can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.
Note 5: The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each
pin.
Note 6: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 250mW rating for
SOT23-5 appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for TJ, 70˚C for TA, and 220˚C/W for
θJA into (Note 4) above. More power can be dissipated at ambient temperatures below 70˚C . Less power can be dissipated at ambient temperatures above 70˚C.
The maximum power dissipation for operation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above
70˚C.
Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TJ = 25˚C or correlated using
Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations
and applying statistical process control.
Note 8: The target output voltage, which is labeled VOUT(nom), is the desired voltage option.
Note 9: An increase in the load current results in a slight decrease in the output voltage and vice versa.
Note 10: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply
for input voltages below 2.5V.
Note 11: Turn-on time is time measured between the enable input just exceeding VIH and the output voltage just reaching 95% of its nominal value.
20020408
FIGURE 1. Output AC Line Regulation Input Perturbation
5 www.national.com
5 Page 
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Micro SMD, 4 Bump Package (BPA04)
NS Package Number bpa04DHC
X1 = 0.853 ± 0.03mm
X2 = 0.955 ± 0.03mm
X3 = 0.900 ± 0.1mm
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Email: [email protected]
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: [email protected]
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
11 Page | ||
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