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PDF CM1213 Data sheet ( Hoja de datos )
| Número de pieza | CM1213 | |
| Descripción | Low Capacitance ESD Protection Arrays | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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CM1213www.DataSheet4U.com
1, 2, 4, 6 and 8-Channel Low Capacitance ESD Protection Arrays
Features
• 1, 2, 4, 6 and 8 channels of ESD protection
• Provides ESD protection to IEC61000-4-2 Level 4
- 8kV contact discharge
- 15kV air discharge
• Low channel input capacitance of 1.0pF typical
• Minimal capacitance change with temperature and
voltage
• Channel input capacitance matching of 0.02pF typ-
ical is ideal for differential signals
• Mutual capacitance between signal pin and adja-
cent signal pin - 0.11pF typical
• Zener diode protects supply rail and eliminates the
need for external by-pass capacitors
• Each I/O pin can withstand over 1000 ESD strikes
• Available in SOT, SOIC and MSOP packages
• Lead-free version available
Applications
• USB2.0 ports at 480Mbps in desktop PCs, note-
books and peripherals
• IEEE1394 Firewire® ports at 400Mbps / 800Mbps
• DVI ports, HDMI ports in notebooks, set top boxes,
digital TVs, LCD displays
• Serial ATA ports in desktop PCs and hard disk
drives
• PCI Express ports
• General purpose high-speed data line ESD
protection
Product Description
The CM1213 family of diode arrays has been designed
to provide ESD protection for electronic components or
sub-systems requiring minimal capacitive loading.
These devices are ideal for protecting systems with
high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a
pair of diodes in series which steer the positive or neg-
ative ESD current pulse to either the positive (VP) or
negative (VN) supply rail. A Zener diode is embedded
between VP and VN, offering two advantages. First, it
protects the VCC rail against ESD strikes, and second,
it eliminates the need for a bypass capacitor that would
otherwise be needed for absorbing positive ESD
strikes to ground. The CM1213 will protect against
ESD pulses up to ±8kV per the IEC 61000-4-2 stan-
dard and using the MIL-STD-883D (Method 3015)
specification for Human Body Model (HBM) ESD, all
pins are protected from contact discharges of greater
than ±15kV.
These devices are particularly well-suited for protecting
systems using high-speed ports such as USB2.0,
IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI
and corresponding ports in removable storage, digital
camcorders, DVD-RW drives and other applications
where extremely low loading capacitance with ESD
protection are required in a small package footprint.
The CM1213 family of devices is available with
optional lead-free finishing.
Electrical Schematics
VP VP
CH4
VP CH3
N.C. N.C. VP N.C. N.C.
CH1
CH1
CH2
VN
CM1213-01ST/SO
CH6
VN
CM1213-02ST/SO
CM1213-02SS/SR
VP CH5 CH4
CH1 VN CH2
CM1213-04ST/SO
CM1213-04MS/MR
CH8
CH7
CH1 CH2 VN CH3 CH4
CM1213-A4MR
VP CH6 CH5
CH1
CH2
VN
CM1213-06MS/MR
CM1213-06SN/SM
CH3
CH1 CH2
VN CH3
CM1213-08MS/MR
CH4
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com
1
1 page  
Performance Information
Input Channel Capacitance Performance Curves
CM1213www.DataSheet4U.com
2
1.5
1
0.5
0
0 0.5 1 1.5 2 2.5 3
Input Voltage (V)
Typical Variation of CIN vs. VIN
(f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN, 25°C)
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
-50
-25
0V DC Input Bias
1.65V DC Input Bias
0 25 50
Temperature (°C)
75 100
Typical Variation of CIN vs. Temp
(f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V,
0.1 μF chip capacitor between VP and VN)
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com
5
5 Page 
Mechanical Details (cont’d)
SOT23-6 Mechanical Specifications
CM1213-04ST/SO devices are supplied in 6-pin
SOT23 packages. Dimensions are presented below.
For complete information on the SOT23-6, see the Cal-
ifornia Micro Devices SOT23 Package Information doc-
ument.
PACKAGE DIMENSIONS
Package
SOT23-6 (JEDEC name is MO-178)
Pins
6
Dimensions
Millimeters
Min Max
Inches
Min Max
A -- 1.45 -- 0.0571
A1 0.00 0.15 0.0000 0.0059
b 0.30 0.50 0.0118 0.0197
c 0.08 0.22 0.0031 0.0087
D 2.75 3.05 0.1083 0.1201
E 2.60 3.00 0.1024 0.1181
E1 1.45 1.75 0.0571 0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
L 0.30 0.60 0.0118 0.0236
L1
0.60 REF
0.0236 REF
# per tape
and reel
3000 pieces
Controlling dimension: millimeters
CM1213www.DataSheet4U.com
Mechanical Package Diagrams
TOP VIEW
e1
e
65 4
Pin 1
Marking
E1 E
12 3
b
SIDE VIEW
D
A
END VIEW
A1
c
L1
L
Package Dimensions for SOT23-6.
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet CM1213.PDF ] | |
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