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PDF TPC6111 Data sheet ( Hoja de datos )

Número de pieza TPC6111
Descripción Field Effect Transistor Silicon P Channel MOS Type
Fabricantes Toshiba Semiconductor 
Logotipo Toshiba Semiconductor Logotipo



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TPC6111
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MwOwSwV.D)ataSheet4U.com
TPC6111
Notebook PC Applications
Portable Equipment Applications
Unit: mm
Low drain-source ON resistance: RDS (ON) = 33 m(typ.)
Low leakage current: IDSS = 10 μA (max) (VDS = 20 V)
Enhancement mode: Vth = 0.3 to 1.0 V
(VDS = 10 V, ID = 1mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-source voltage
Drain-gate voltage (RGS = 20 kΩ)
Gate-source voltage
Drain current
DC (Note 1)
Pulse (Note 1)
Drain power dissipation
(t = 5 s)
(Note 2a)
Drain power dissipation
(t = 5 s)
(Note 2b)
Single pulse avalanche energy (Note 3)
Avalanche current
Repetitive avalanche energy (Note 4)
Channel temperature
Storage temperature range
VDSS
VDGR
VGSS
ID
IDP
PD
PD
EAS
IAR
EAR
Tch
Tstg
20
20
±8
5.5
22
2.2
0.7
5.1
2.8
0.019
150
55~150
V
V
V
A
W
W
mJ
A
mJ
°C
°C
JEDEC
JEITA
TOSHIBA
2-3T1A
Weight: 0.011 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Symbol
Max Unit
Thermal resistance, channel to ambient (t = 5 s)
(Note 2a)
Thermal resistance, channel to ambient (t = 5 s)
(Note 2b)
Rth (ch-a)
Rth (ch-a)
56.8 °C/W
178.5 °C/W
Note: (Note 1), (Note 2), (Note 3), (Note 4) and (Note 5): See other pages.
This transistor is an electrostatic-sensitive device. Please handle with caution.
Circuit Configuration
654
123
1 2009-05-12

1 page




TPC6111 pdf
RDS (ON) – Ta
150
Common source
Pulse test
120
ID = −5.5 A
90 VGS = −1.5 V
2.8 A
1.4 A
60
30
0
80
1.8 V
2.5 V
4.5 V
40 0 40 80 120
Ambient temperature Ta (°C)
160
TPC6111
www.DataSheet4U.com
100
10
1
0.1
0
IDR – VDS
4.5
2.5 1.8 1.5
1
VGS = 0 V
Common source
Ta = 25°C
Pulse test
0.3 0.6 0.9 1.2 1.5
Drain-source voltage VDS (V)
10000
Capacitance – VDS
1000
Ciss
Coss
100
Crss
10
Common source
VGS = 0 V
f = 1 MHz
Ta = 25°C
1
0.1
1
10
Drain-source voltage VDS (V)
100
Vth – Ta
1
Common source
VDS = −10 V
0.8
ID = −1 mA
Pulse test
0.6
0.4
0.2
0
80 40
0
40 80 120 160
Ambient temperature Ta (°C)
2.5
(1) t = 5s
2.0
1.5
PD – Ta
(1) Device mounted on a glass-epoxy
board (a) (Note 2a)
(2) Device mounted on a glass-epoxy
board (b) (Note 2b)
1.0
(2) t = 5s
0.5
0
0 40 80 120 160
Ambient temperature Ta (°C)
Dynamic input/output characteristics
20
VDS
16
10
8
12 8 V 6
4 V
VDD = −16 V
8 4
Common source
ID = −5.5 A
4
VGS
Ta = 25°C
Pulse test
2
00
0 4 8 12 16
Total gate charge Qg (nC)
5 2009-05-12

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