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PDF ESDA8V2-1MX2 Data sheet ( Hoja de datos )
| Número de pieza | ESDA8V2-1MX2 | |
| Descripción | EOS and ESD Transil protection | |
| Fabricantes | STMicroelectronics | |
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ESDA8V2-1MX2
EOS and ESD Transil™ protection for charger and battery port
Features
■ Breakdown voltage VBR = 8.2 V
■ Unidirectional device
■ High peak power dissipation: 500 W
(8/20 µs waveform)
■ ESD protection level better than
IEC 61000-4-2, level 4:
30 kV contact discharge
■ Low leakage current (< 0.5 µA @ 5 V)
■ Very small PCB area (1.45 mm2)
■ RoHS compliant
Benefits
■ High EOS and ESD protection level
■ High integration
■ Suitable for high density boards
■ Tiny package
Complies with the following standards:
■ IEC 61000-4-2 level 4
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7: class 3B
– HBM (human body model): ≥8kV
Applications
Where EOS and ESD transient overvoltage
protection in sensitive equipment is required,
such as:
■ Computers
■ Printers
■ Communication systems
■ Cellular phone handsets and accessories
■ Video equipment
µQFN 2L package
Figure 1. Functional diagram (top view)
Description
The ESDA8V2-1MX2 is a unidirectional single line
Transil diode designed specifically for the
protection of integrated circuits in portable
equipment and miniaturized electonic devices
subject to EOS and ESD transient overvoltages.
TM: Transil is a trademark of STMicroelectronics
August 2008
Rev 1
1/10
www.st.com
1 page  
www.DataSEhSeeDt4AU8.cVo2m-1MX2
3 Package information
Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 4. µQFN 2L dimensions
Dimensions
Ref Millimetres
Inches
Min Typ Max Min Typ Max
A 0.51 0.55 0.60 0.020 0.022 0.024
A1 0.00 0.02 0.05 0.000 0.001 0.002
b1 0.25 0.30 0.35 0.010 0.012 0.014
D 1.45
0.057
E 1.00
0.039
e 0.95 1.00 1.05 0.037 0.039 0.041
L1 0.75 0.80 0.85 0.030 0.031 0.033
Figure 10. Footprint (dimensions in mm) Figure 11. Marking
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
5/10
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| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet ESDA8V2-1MX2.PDF ] | |
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