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PDF BTC2411N3 Data sheet ( Hoja de datos )
| Número de pieza | BTC2411N3 | |
| Descripción | Gentral Purpose NPN Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics | |
| Logotipo |  |
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CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
BTC2411N3
Spec. No. : C203N3
Issued Date : 2002.05.11
Revised Date : 2005.03.09
Page No. : 1/5
Description
• The BTC2411N3 is designed for using in driver stage of AF amplifier and general purpose switching
application.
• High IC(Max), IC(Max) = 0.6A.
• Low VCE(sat) , Typ. VCE(sat) = 0.4V at IC/IB = 500mA/50mA.
Optimal for low Voltage operation.
• Complementary to BTA1036N3.
• Pb-free package
Symbol
BTC2411N3
Outline
SOT-23
B：Base
C：Collector
E：Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation (TA=25°C)
Power Dissipation (TC=25°C)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Junction Temperature
Storage Temperature
Note : Free air condition
BTC2411N3
Symbol
VCBO
VCEO
VEBO
IC
PD
PD
RθJA
RθJC
Tj
Tstg
Limits
75
40
6
0.6
225 (Note)
560
556 (Note)
223
150
-55~+150
Unit
V
V
V
A
mW
mW
°C/W
°C/W
°C
°C
CYStek Product Specification
1 page  
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CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C203N3
Issued Date : 2002.05.11
Revised Date : 2005.03.09
Page No. : 5/5
A
L
3
S
B
12
VG
C
D H KJ
Marking:
2TXE
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style: Pin 1.Base 2.Emitter 3.Collector
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.1102 0.1204 2.80 3.04
B 0.0472 0.0630 1.20 1.60
C 0.0335 0.0512 0.89 1.30
D 0.0118 0.0197 0.30 0.50
G 0.0669 0.0910 1.70 2.30
H 0.0005 0.0040 0.013 0.10
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
J 0.0034 0.0070 0.085 0.177
K 0.0128 0.0266 0.32 0.67
L 0.0335 0.0453 0.85 1.15
S 0.0830 0.1083 2.10 2.75
V 0.0098 0.0256 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC2411N3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTC2411N3.PDF ] | |
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