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PDF ESDA14V2-4BF3 Data sheet ( Hoja de datos )
| Número de pieza | ESDA14V2-4BF3 | |
| Descripción | Quad bidirectional TRANSIL array | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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ESDA14V2-4BF3
Quad bidirectional Transil™ array for ESD protection
Features
■ 4 Bidirectional Transil functions
■ ESD Protection: IEC61000-4-2 level 4
■ Stand off voltage: 12 V Min.
■ Low leakage current < 0.5 µA
■ 50 W Peak pulse power (8/20 µs)
Benefits
■ High ESD protection level
■ High integrationSuitable for high density
boards
■ Suitable for high density boards
Complies with the following standards:
■ IEC 61000-4-2
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883E- Method 3015-7: class3
– 25 kV (human body model)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as :
■ Computers
■ Printers
■ Communication systems and cellular phones
■ Video equipment
TM: Transil is ASD a trademark of STMicroelectronics.
Flip Chip
(5 bumps)
Figure 1. Pin layout (bump side)
32 1
A
B
C
Figure 2. Configuration
A1 A3 C1
C3
B2
GND
Description
The ESDA14V2-4BF3 is a monolithic array
designed to protect up to 4 lines in a bidirectional
way against ESD transients.The device is ideal for
situations where board space saving is
requested.
This device is particularly adapted to the
protection of symmetrical signals.
April 2008
Rev 3
1/8
www.st.com
1 page  
www.DataSEhSeeDt4AU1.c4oVm2-4BF3
3 Ordering information scheme
Ordering information scheme
Figure 11. Ordering information scheme
ESDA 14V2 - 4 B Fx
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip Chip
x = 3: lead-free, pitch = 400µm, bump height = 255 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 12. Package dimensions
185 µm ± 10
565 µm ± 40
255 µm ± 40
605 µm ± 55
185 µm
0.935 mm ± 30µm
5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet ESDA14V2-4BF3.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ESDA14V2-4BF1 | QUAD BIDIRECTIONAL TRANSIL-TM ARRAY |  STMicroelectronics |
| ESDA14V2-4BF2 | QUAD BIDIRECTIONAL TRANSIL-TM ARRAY | STMicroelectronics |
| ESDA14V2-4BF3 | Quad bidirectional TRANSIL array | ST Microelectronics |
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