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PDF TLFGE19CPF Data sheet ( Hoja de datos )
| Número de pieza | TLFGE19CPF | |
| Descripción | Panel Circuit Indicator | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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TOSHIBA InGaAlP LED
TLFGE19CP(F)
TLFGE19CP(F)
○ Panel Circuit Indicator
• Pb(Lead) free (Sn-Ag-Cu)
• 5mm package
• InGaAℓP
• Colored, transparent lens
• Color: Green
• Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting illumination sources.
www.DataSheet•4U.cSotmopper lead type is also available.
TLFGE19C(F)
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTICS
SYMBOL
RATING
UNIT
FORWARD CURRENT
IF 50 mA
REVERSE VOLTAGE
VR 4 V
POWER DISSIPATION
PD 120 mW
OPERATING TEMPERATURE
Topr
−40~100
°C
JEDEC
-
STORAGE TEMPERATURE
Tstg
−40~120
°C
EIAJ
-
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
TOSHIBA
4-5AM2
temperature, etc.) may cause this product to decrease in the
Weight: 0. 31g(Typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
CHARACTERISTICS
FORWARD VOLTAGE
REVERSE CURRENT
LUMINOUS INTENSITY
PEAK WAVELENGTH
SPECTRAL LINE HALF WIDTH
DOMINANT WAVELENGTH
SYMBOL
TEST CONDITION
VF IF=20mA
IR VR=4V
IV IF=20mA(Note)
λP IF=20mA
Δλ IF=20mA
λd IF=20mA(Note)
MIN
⎯
⎯
272
⎯
⎯
559
TYP
2.0
⎯
800
(568)
15
565
MAX UNIT
2.4 V
50 μA
⎯ mcd
⎯ nm
⎯ nm
570 nm
Note: Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
IV ､Q:272-736mcd, R:476-1290mcd, S:850mcd - ､λd､1: 559-567nm, 2: 563-570nm
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming
stress to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.
1 2007-10-01
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet TLFGE19CPF.PDF ] | |
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