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PDF MPXV4115V Data sheet ( Hoja de datos )
| Número de pieza | MPXV4115V | |
| Descripción | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Technical Data
MPXV4115V
Rev 2, 05/2005
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated, and
Calibrated
The MPXV4115V series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
particularly those employing a microcontroller with A/D inputs. This transducer
combines advanced micromachining techniques, thin-film metallization and
bipolar processing to provide an accurate, high-level analog output signal that is
proportional to the applied pressure/vacuum. The small form factor and high
reliability of on-chip integration make the sensor a logical and economical choice
for the automotive system designer. Figure 1 shows a block diagram of the
internal circuitry integrated on a pressure sensor chip.
Features
• 1.5% Maximum error over 0° to 85°C
• Temperature Compensated from –40° + 125°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Durable Thermoplastic (PPS) Surface Mount Package
Typical Applications
• Vacuum Pump Monitoring
• Brake Booster Monitoring
The MPXV4115V series pressure sensors are available in the basic element
package or with a pressure port. Two packing options are also offered.
ORDERING INFORMATION
Device Type Case No.
MPX Series
Order No.
Packing
Options
Device
Marking
SMALL OUTLINE PACKAGE (MPXV4115V SERIES)
Basic
Elements
482 MPXV4115V6U
482 MPXV4115V6T1
Rails
MPXV4115V
Tape & Reel MPXV4115V
Ported
Elements
482A MPXV4115VC6U
Rails
MPXV4115V
MPXV4115V
SERIES
INTEGRATED
PRESSURE SENSOR
–115 to 0 kPa (–16.7 to 2.2 psi)
0.2 to 4.6 V OUTPUT
SMALL OUTLINE PACKAGE
MPXV4115V6U/6T1
CASE 482-01
MPXV4115VC6U
CASE 482A-01
PIN NUMBER(1)
1 N/C 5
2 VS 6
3 GND 7
4 VOUT 8
N/C
N/C
N/C
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
1 page  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.060 TYP 8X
1.52
0.660
16.76
0.100 TYP 8X
2.54
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. SOP Footprint (Case 482)
Sensors
Freescale Semiconductor
MPXV4115V
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MPXV4115V.PDF ] | |
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