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PDF BTD1760J3 Data sheet ( Hoja de datos )
| Número de pieza | BTD1760J3 | |
| Descripción | NPN Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
BTD1760J3
Spec. No. : C848J3
Issued Date : 2003.04.18
Revised Date : 2005.10.04
Page No. : 1/5
Features
• Low VCE(sat), VCE(sat)=0.25 V (typical), at IC / IB = 2A / 0.2A
• Excellent current gain characteristics
• Complementary to BTB1184J3
• Pb-free package
Symbol
BTD1760J3
Outline
TO-252
B：Base
C：Collector
E：Emitter
BCE
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Collector-Base Voltage
VCBO
50
Collector-Emitter Voltage
VCEO
50
Emitter-Base Voltage
VEBO
5
Collector Current(DC)
IC 3
Collector Current(Pulse)
ICP 7 *1
Power Dissipation(TA=25℃)
Pd(TA=25℃)
1
Power Dissipation(TC=25℃)
Pd(TC=25℃)
15 *2
Junction Temperature
Tj 150
Storage Temperature
Tstg -55~+150
Note : *1. Single Pulse Pw=10ms
*2 Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm or larger
Unit
V
V
V
A
W
°C
°C
BTD1760J3
CYStek Product Specification
1 page  
CYStech Electronics Corp.
TO-252 Dimension
Spec. No. : C848J3
Issued Date : 2003.04.18
Revised Date : 2005.10.04
Page No. : 5/5
AC
B
L
F
D
G
EK
3
H
2
I
1
J
Marking:
D1760
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0650 0.0768
C 0.0354 0.0591
D 0.0177 0.0236
E 0.2520 0.2677
F 0.2125 0.2283
Millimeters
Min. Max.
0.45 0.55
1.65 1.95
0.90 1.50
0.45 0.60
6.40 6.80
5.40 5.80
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
G 0.0866 0.1102 2.20 2.80
H
- *0.0906 -
*2.30
I
- 0.0354 -
0.90
J
- 0.0315 -
0.80
K 0.2047 0.2165 5.20 5.50
L 0.0551 0.0630 1.40 1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD1760J3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTD1760J3.PDF ] | |
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