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Número de pieza | MC10H175 | |
Descripción | Quint Latch | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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MC10H175
Quint Latch
Description
The MC10H175 is a quint D type latch with common reset and
clock lines. This MECL 10KH part is a functional/pinout duplication
of the standard MECL 10K™ family part, with 100% improvement in
propagation delay and no increase in power−supply current.
Features
• Propagation Delay, 1.2 ns Typical
• Power Dissipation, 400 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K Compatible
• Pb−Free Packages are Available*
TRUTH TABLE
D C0 C1 Reset
LL
HL
XH
XX
XH
XX
L
L
X
H
X
H
X
X
L
L
H
H
Qn+1
L
H
Qn
Qn
L
L
DIP
PIN ASSIGNMENT
VCC1
1
Q2 2
Q3 3
Q4 4
D4 5
C0 6
C1 7
VEE 8
16 VCC2
15 Q1
14 Q0
13 D2
12 D1
11 RESET
10 D0
9 D3
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
http://onsemi.com
MARKING DIAGRAMS*
CDIP−16
L SUFFIX
CASE 620A
16
MC10H175L
AWLYYWW
1
16
16
1
PDIP−16
P SUFFIX
CASE 648
MC10H175P
AWLYYWWG
1
10H175
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
10H175G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
MC10H175/D
1 page −L−
20
MC10H175
PACKAGE DIMENSIONS
−N− Y BRK
−M−
W
1
V
20 LEAD PLLC
CASE 775−02
ISSUE E
B 0.007 (0.180) M T L−M S N S
U 0.007 (0.180) M T L−M S N S
D
Z
D X G1 0.010 (0.250) S T L−M S N S
VIEW D−D
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S
CE
K1
0.004 (0.100)
G J −T− SEATING
PLANE
VIEW S
G1
K
F
VIEW S
0.007 (0.180) M T L−M S N S
0.010 (0.250) S T L−M S N S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.385 0.395
B 0.385 0.395
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 −−−
K 0.025 −−−
R 0.350 0.356
U 0.350 0.356
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y −−− 0.020
Z 2 _ 10 _
G1 0.310 0.330
K1 0.040 −−−
MILLIMETERS
MIN MAX
9.78 10.03
9.78 10.03
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 −−−
0.64 −−−
8.89 9.04
8.89 9.04
1.07 1.21
1.07 1.21
1.07 1.42
−−− 0.50
2 _ 10 _
7.88 8.38
1.02 −−−
http://onsemi.com
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Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet MC10H175.PDF ] |
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