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PDF SST39WF1602 Data sheet ( Hoja de datos )
| Número de pieza | SST39WF1602 | |
| Descripción | (SST39WF1601 / SST39WF1602) 1M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured | |
| Fabricantes | Silicon Storage Technology | |
| Logotipo |  |
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16 Mbit (x16) Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
FEATURES:
SST39WF160x2.7V 16Mb (x16) MPF+ memories
Preliminary Specifications
• Organized as 1M x16
• Single Voltage Read and Write Operations
– 1.65-1.95V
• Superior Reliability
– Endurance: 100,000 Cycles (Typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 5 mA (typical)
– Standby Current: 5 µA (typical)
– Auto Low Power Mode: 5 µA (typical)
• Hardware Block-Protection/WP# Input Pin
– Top Block-Protection (top 32 KWord)
for SST39WF1602
– Bottom Block-Protection (bottom 32 KWord)
for SST39WF1601
• Sector-Erase Capability
– Uniform 2 KWord sectors
• Block-Erase Capability
– Uniform 32 KWord blocks
• Chip-Erase Capability
• Erase-Suspend/Erase-Resume Capabilities
• Hardware Reset Pin (RST#)
• Security-ID Feature
– SST: 128 bits; User: 128 bits
• Fast Read Access Time:
– 90 ns
• Latched Address and Data
• Fast Erase and Word-Program:
– Sector-Erase Time: 36 ms (typical)
– Block-Erase Time: 36 ms (typical)
– Chip-Erase Time: 140 ms (typical)
– Word-Program Time: 28 µs (typical)
• Automatic Write Timing
– Internal VPP Generation
• End-of-Write Detection
– Toggle Bits
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pin Assignments and
Command Sets
• Packages Available
– 48-ball TFBGA (6mm x 8mm)
– 48-ball WFBGA (5mm x 6mm)
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST39WF1601/1602 devices are 1M x16 CMOS
Multi-Purpose Flash Plus (MPF+) manufactured with
SST’s proprietary, high-performance CMOS SuperFlash
technology. The split-gate cell design and thick-oxide tun-
neling injector attain better reliability and manufacturability
compared with alternate approaches. The SST39WF1601/
1602 write (Program or Erase) with a 1.65-1.95V power
supply. These devices conform to JEDEC standard pin
assignments for x16 memories.
Featuring high performance Word-Program, the
SST39WF1601/1602 devices provide a typical Word-Pro-
gram time of 28 µsec. These devices use Toggle Bit or
Data# Polling to indicate the completion of Program opera-
tion. To protect against inadvertent write, they have on-chip
hardware and Software Data Protection schemes.
Designed, manufactured, and tested for a wide spectrum of
applications, these devices are offered with a guaranteed
typical endurance of 100,000 cycles. Data retention is rated
at greater than 100 years.
The SST39WF1601/1602 devices are suited for applica-
tions that require convenient and economical updating of
program, configuration, or data memory. For all system
applications, they significantly improve performance and
reliability, while lowering power consumption. They inher-
ently use less energy during Erase and Program than
alternative flash technologies. The total energy consumed
is a function of the applied voltage, current, and time of
application. Since for any given voltage range, the Super-
Flash technology uses less current to program and has a
shorter erase time, the total energy consumed during any
Erase or Program operation is less than alternative flash
technologies. These devices also improve flexibility while
lowering the cost for program, data, and configuration stor-
age applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose
Erase and Program times increase with accumulated
Erase/Program cycles.
©2006 Silicon Storage Technology, Inc.
S71297-01-000
7/06
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
1 page  
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16 Mbit Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
Common Flash Memory Interface (CFI)
The SST39WF1601/1602 contain the CFI information to
describe the characteristics of the device. The
SST39WF1601/1602 support the original SST CFI Query
mode implementation for compatibility with existing SST
devices as well as the general CFI Query mode. Both will
be explained in subsequent paragraphs.
In order to enter the SST CFI Query mode, the system
must write the three-byte sequence, same as the product
ID entry command with 98H (CFI Query command) to
address 5555H in the last byte sequence. Once the device
enters CFI Query mode, the system can read CFI data at
the addresses given in Tables 7 through 9. The system
must write the CFI Exit command to return to Read mode
from the CFI Query mode.
In order to enter the general CFI Query mode, the system
must write a one-byte sequence with entry command with
98H to address 55H. Once the device enters the CFI
Query mode, the system can read CFI data at the
addresses given in Tables 7 through 9. The system must
write the CFI Exit command to return to Read mode from
the CFI Query mode.
Product Identification
The Product Identification mode identifies the devices as
the SST39WF1601, SST39WF1602 and manufacturer as
SST. This mode may be accessed software operations.
Users may use the Software Product Identification opera-
tion to identify the part (i.e., using the device ID) when
using multiple manufacturers in the same socket. For
details, see Table 6 for software operation, Figure 12 for
the Software ID Entry and Read timing diagram and Fig-
ure 22 for the Software ID Entry command sequence
flowchart.
TABLE 3: Product Identification
Manufacturer’s ID
Device ID
SST39WF1601
SST39WF1602
Address
0000H
0001H
0001H
Data
BFH
BF274B
BF274A
T3.0 1297
Preliminary Specifications
Product Identification Mode Exit/
CFI Mode Exit
In order to return to the standard Read mode, the Software
Product Identification mode must be exited. Exit is accom-
plished by issuing the Software ID Exit command
sequence, which returns the device to the Read mode.
This command may also be used to reset the device to the
Read mode after any inadvertent transient condition that
apparently causes the device to behave abnormally, e.g.,
not read correctly. Please note that the Software ID Exit/
CFI Exit command is ignored during an internal Program or
Erase operation. See Table 6 for software command
codes, Figure 14 for timing waveform, and Figures 22 and
23 for flowcharts.
Security ID
The SST39WF1601/1602 devices offer a 256-bit Security
ID space. The Secure ID space is divided into two 128-bit
segments - one factory programmed segment and one
user programmed segment. The first segment is pro-
grammed and locked at SST with a random 128-bit num-
ber. The user segment is left un-programmed for the
customer to program as desired.
To program the user segment of the Security ID, the user
must use the Security ID Word-Program command. To
detect end-of-write for the SEC ID, read the toggle bits. Do
not use Data# Polling. Once this is complete, the Sec ID
should be locked using the User Sec ID Program Lock-Out.
This disables any future corruption of this space. Note that
regardless of whether or not the Sec ID is locked, neither
Sec ID segment can be erased.
The Secure ID space can be queried by executing a three-
byte command sequence with Enter Sec ID command
(88H) at address 5555H in the last byte sequence. To exit
this mode, the Exit Sec ID command should be executed.
Refer to Table 6 for more details.
©2006 Silicon Storage Technology, Inc.
5
S71297-01-000
7/06
5 Page 
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16 Mbit Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
Preliminary Specifications
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
Operating Range
Range
Commercial
Industrial
Ambient Temp
0°C to +70°C
-40°C to +85°C
VDD
1.65-1.95V
1.65-1.95V
AC Conditions of Test
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF
See Figures 18 and 19
©2006 Silicon Storage Technology, Inc.
11
S71297-01-000
7/06
11 Page | ||
| Páginas | Total 29 Páginas | |
| PDF Descargar | [ Datasheet SST39WF1602.PDF ] | |
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