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PDF TQM713019 Data sheet ( Hoja de datos )
| Número de pieza | TQM713019 | |
| Descripción | 3V HBT GaAs CDMA 4x4mm Power Amplifier Module | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Functional Block Diagram
Vref 1
Vmode 2
GND 3
1 Bit Bias Control
RFin 4
Vcc1 5
10 GND
9 GND
8 RFout
7 GND
6 Vcc2
Product Description
Features
• InGaP HBT Technology
• High Efficiency: 41% CDMA
• Low Leakage Current: < 1uA
• Low Icq = 55mA
• Supports new chipsets with Vref @ 2.6V
• Capable of running as 0-bit PA in low bias
mode to 28dBm
• Optimized for 50Ω system
• Small 10 pin 4x4mm module
• Excellent Rx band noise performance
• CDMA 1XRTT, 1XEV-DO compliant
• Full ESD protection
The TQM713019 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for
use in mobile phones. Its extremely small 4x4mm package makes it ideal for
www.DataSheet4U.comtoday’s compact data enabled phones. Its RF performance meets the
Applications
• IS-95 / CDMA2000
requirements for products designed to IS-95/98 standards.
• Single mode, dual mode, and tri mode
The TQM713019 is designed on TriQuint’s advanced InGaP HBT GaAs
CDMA/AMPS phones
technology offering state of the art reliability, temperature stability, and
ruggedness. Selectable bias mode and a shutdown mode with low leakage
current improves talk and standby time. The output match, realized within the Package Style
module package, optimizes efficiency/linearity at maximum rated output power.
The module is a 4x4mm land grid array with backside ground. The TQM713019 is 4mm x 4mm LGA package
footprint compatible with industry standard 4x4mm CDMA PA modules.
Electrical Specifications
Parameter
Frequency
CDMA mode maximum Pout1
Gain
CDMA ACPR
CDMA ALTR
Power Supply Current @ 28dBm
IREF
Rx Band Noise
Min
824
Typ Max
849
28
29
50
65
450
2.0
-140
Units
MHz
dBm
dB
dBc
dBc
mA
mA
dBm/Hz
Note 1 : CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.85VDC, Tc=25°C
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website: www.triquint.com
Rev. D, March 2005
1
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1 page  
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TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Pin Out and Assignments
Vref 1
Vmode 2
GND 3
RFin 4
Vcc1 5
1 Bit Bias Control
10 GND
9 GND
8 RFout
7 GND
6 Vcc2
www.DataSheet4U.comPin Symbol
Description
1
VREF
Regulated voltage for bias setting. VREF is set to 0VDC to
power off the TQM713019
2
VMODE
1 step bias control
3 GND Ground
4
RFIN
RF input. The RF circuit is DC grounded internally2. 50
Ohm RF impedance.
5 VCC1 Collector voltage for input stage
6 VCC2 Collector voltage for output stage
7 GND Ground
8
RFOUT
RF output. The RF circuit is DC blocked internally. 50 Ohm
RF impedance
9 GND Ground
10 GND Ground
Paddle1
GND Device ground and thermal path for heat removal
Note 1: TriQuint recommends the use of several via holes to the backside ground under the paddle
Note2: Internal DC ground for RFIN
RFin
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website: www.triquint.com
Rev. D, March 2005
5
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5 Page 
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TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Packaging and Ordering Information
Package Type: 10 Pin Plastic Module Package
Pin 1
2
3
4
5
5
4
3
2
1
10
9
8
7 Side View
www6.DataSheet4U.com
Top View
DESIGNATION
DESCRIPTION
DIMENSION
A
OVERALL HEIGHT
1.5 +/-0.12 mm
D
PACKAGE LENGTH
4.0 +/-0.1 mm
E
PACKAGE WIDTH
4.0 +/-0.1 mm
J SOLDER MASK OPENING LENGTH AND 0.575 +/-0.075 mm
WIDTH
K
METAL PAD LENGTH AND WIDTH
0.40 +/-0.05 mm
6 P DISTANCE BETWEEN METAL PAD AND 0.10 +/-0.025 mm
PACKAGE EDGE
7
T GND SOLDER MASK OPENING WIDTH 2.00 +/-0.05 mm
S GND SOLDER MASK OPENING LENGTH 3.80 +/-0.05 mm
R DISTANCE BETWEEN GND SOLDER 0.10 +/-0.1 mm
8 MASK OPENING AND PACKAGE EDGE
Q DISTANCE BETWEEN GND SOLDER 1.00 +/-0.1 mm
MASK OPENING AND PACKAGE EDGE
9
e
TERMINAL PITCH FOR TERMINAL 1-10, 3.400
mm
2-9, 3-8, 4-7 AND 5-6
e1
TERMINAL PITCH FOR TERMINAL 1-2-3- 0.850
mm
10 4-5 AND 6-7-8-9-10
Note: GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE
Bottom View
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website: www.triquint.com
Rev. D, March 2005
11
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| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet TQM713019.PDF ] | |
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