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PDF STPAC01F2 Data sheet ( Hoja de datos )
| Número de pieza | STPAC01F2 | |
| Descripción | RF Detector | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de STPAC01F2 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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et4U.com®
taSheIPAD™
STPAC01F2
RF DETECTOR FOR
POWER AMPLIFIER CONTROL
w.DaMAIN PRODUCT CHARACTERISTICS
wThe STPAC01F2 has two outputs, one for the sig-
w nal detection and another one for the temperature
compensation:
■ VDCout = 0.88 V at 0.85 GHz at 10 dBm
m■ VDCout = 1.07 V at 1.85 GHz at 10 dBm
o■ Vsupply = 5 V max
.c■ Lead free package
DESCRIPTION
UThe STPAC01F2 is an integrated RF detector for
the power control stage. It converts RF signal
t4coming from the coupler into a DC signal usable
by the digital stage. It is based on the use of two
esimilar diodes, one providing the signal detection
while the second one is used to provide a temper-
eature information to thermal compensation stage.
A biasing stage suppresses the detection diode
hdrop voltage effect.
Target applications are cellular phones and PDA
Susing GSM, DCS, PCS, AMPS, TDMA, CDMA and
ta800 MHz to 1900 MHz frequency ranges.
BENEFITS
a■ The use of IPAD technology allows the RF
front-end designer to save PCB area and to
.Ddrastically suppress parasitic inductances.
Flip-Chip
(8 Bumps)
Table 1: Order Code
Part Number
STPAC01F2
Marking
RA
Figure 1: Pin Configuration (Ball side)
321
DC
out
V
Temp
A
Gnd1 Gnd1 Gnd2 B
RFin Gnd1 Bias C
Figure 2: Functional diagram
www Coupler
VBIAS
October 2004
REV. 1
RF input
omRF detector
Low pass
filter
VDCOut
.cThermal
Ucompensation
t4STPAC01F2
Vtemp
heeGND1
GND2
www.DataS 1/7
1 page  
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
STPAC01F2
650µm ± 65
1.57mm ± 50µm
Figure 12: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
365 240
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet STPAC01F2.PDF ] | |
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