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PDF MBRM110ET3 Data sheet ( Hoja de datos )

Número de pieza MBRM110ET3
Descripción Surface Mount Schottky Power Rectifier
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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MBRM110E
Surface Mount
Schottky Power Rectifier
POWERMITE®
Power Surface Mount Package
The Schottky Powermite employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop–reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles, < 1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are ac/dc and dc–dc
converters, reverse battery protection, and “Oring” of multiple supply
voltages and any other application where performance and size are
critical.
Features:
Low IR Extends Battery Life
Low Profile – Maximum Height of 1.1 mm
Small Footprint – Footprint Area of 8.45 mm2
150°C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
Mechanical Characteristics:
Powermite is JEDEC Registered as D0–216AA
Case: Molded Epoxy
Epoxy Meets UL 94V–O at 1/8
Weight: 62 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes.
260°C Maximum for 10 Seconds
MAXIMUM RATINGS
Please See the Table on the Following Page
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
10 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
PLASTIC
MARKING DIAGRAM
M
1E1
1E1 = Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
MBRM110ET1 POWERMITE 3,000/Tape & Reel
MBRM110ET3 POWERMITE 12,000/Tape & Reel
© Semiconductor Components Industries, LLC, 2001
October, 2001 – Rev. 0
1
Publication Order Number:
MBRM110E/D

1 page




MBRM110ET3 pdf
MBRM110E
1.0
50%
20%
0.1 10%
5.0%
0.01 2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
T, TIME (s)
Figure 8. Thermal Response Junction to Lead
1.0
50%
20%
0.1
10%
5.0%
0.01 2.0%
0.001 1.0%
0.00001
0.0001
Rtjl(t) = Rtjl*r(t)
0.001
0.01
0.1
1.0
T, TIME (s)
Figure 9. Thermal Response Junction to Ambient
0.105
2.67
0.025
0.635
0.030
0.762
10
0.100
2.54
0.050
1.27
inches
mm
Minimum Recommended Footprint
100 1,000
http://onsemi.com
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