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PDF MIC7111BM5 Data sheet ( Hoja de datos )

Número de pieza MIC7111BM5
Descripción 1.8V IttyBitty Rail-to-Rail Input/Output Op Amp Preliminary Information
Fabricantes Micrel Semiconductor 
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MIC7111
Micrel
MIC7111
1.8V IttyBitty™ Rail-to-Rail Input/Output Op Amp
Preliminary Information
General Description
The MIC7111 is a micropower operational amplifier featuring
rail-to-rail input and output performance in Micrel’s IttyBitty
SOT-23-5 package. The MIC7111 is ideal for systems where
small size is a critical consideration.
The MIC7111 is designed to operate from 1.8V to 11V power
supplies.
The MIC7111 benefits small battery operated portable elec-
tronic devices where small size and the ability to place the
amplifier close to the signal source are primary design
concerns.
For other package options, please contact the factory.
Features
• Small footprint SOT-23-5 package
• Guaranteed performance at 1.8V, 2.7V, 5V, and 10V
• 15µA typical supply current at 1.8V
• 25kHz gain-bandwidth at 5V
• Output swing to within 1mV of rails
with 1.8V supply and 100kload
• Suitable for driving capacitive loads
Applications
• Wireless and cellular communications
• GaAs RF amplifier bias amplifier
• Current sensing for battery chargers
• Reference voltage buffer
• Transducer linearization and interface
• Portable computing
Ordering Information
Part Number
MIC7111BM5
Junction Temp. Range
–40°C to +85°C
Package
SOT-23-5
Pin Configuration
IN+ V+ OUT
3 21
A13
45
IN– V–
Part
Identification
Functional Configuration
IN+ V+ OUT
3 21
45
IN– V–
SOT-23-5 (M5)
Pin Description
Pin Number
1
2
3
4
5
Pin Name
OUT
V+
IN+
IN–
V–
Pin Function
Amplifier Output
Positive Supply
Noninverting Input
Inverting Input
Negative Suppy
IttyBitty is a trademark of Micrel, Inc.
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
June 1998
1
MIC7111

1 page




MIC7111BM5 pdf
MIC7111
Micrel
Symbol
Parameter
Condition
Min Typ Max Units
IB Input Bias Current
1 10 pA
500 pA
IOS Input Offset Current
0.01 0.5
75
pA
pA
RIN
+PSRR
–PSRR
CMRR
CIN
VOUT
Input Resistance
Positive Power Supply
Rejection Ratio
Negative Power Supply
Rejection Ratio
Common-Mode Rejection Ratio
Common Mode Input Capacitance
Output Voltage Swing
5V VV+ 10V, VV– = 0V,
VCM = VOUT = 2.5V
–5V VV– –10V, VV+ = 0V,
VCM = VOUT = –2.5V
VCM = –0.2V to +10.2V
output high, RL = 100k,
specified as VV+ – VOUT
output low, RL = 100k
>10
65 95
T
dB
65 95
dB
60 85
dB
3 pF
0.45 2.5
2.5
mV
mV
0.45 2.5
2.5
mV
mV
output high, RL = 2k,
specified as VV+ – VOUT
output low, RL = 2k
24 80 mV
120 mV
24 80 mV
120 mV
ISC
AVOL
Output Short Circuit Current
Note 6
Voltage Gain
sourcing, VOUT = 0V
sinking, VOUT = 10V
sourcing
sinking
100 200
100 200
500
500
mA
mA
V/mV
V/mV
IS Supply Current
VV+ = 10V, VOUT = VV+/2
25 65 µA
AC Electrical Characteristics (10V)
V+ = +10V, V– = 0V, VCM = VOUT = VV+/2; RL = 1M; TJ = 25°C, bold values indicate –40°C TJ +85°C; unless noted
Symbol
Parameter
Condition
Min Typ Max
Units
SR
GBW
Slew Rate
Gain Bandwidth Product
voltage follower, 1V step, RL = [email protected]
VOUT = 1VP–P
0.02
25
V/µs
kHz
φM Phase Margin
GM Gain Margin
50 °
15 dB
eN
Input Referred Voltage Noise
f = 1kHz, VCM = 1.0V
110 nV/ Hz
iN
Input Referred Current Noise
f = 1kHz
0.03
pA/ Hz
General Notes: Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing on statistical analysis.
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside its recommended operating ratings.
Note 2: I/O Pin Voltage is any external voltage to which an input or output is referenced.
Note 3:
Note 4:
Note 5:
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max); the junction-to-ambient thermal
resistance, θJA; and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:
PD = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal resistance, θJA, applies to a part soldered on a printed-circuit board.
Human body model, 1.5k in series with 100pF.
Note 6: Short circuit may cause the device to exceed maxium allowable power dissipation. See Note 3.
June 1998
5
MIC7111

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