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PDF MCP1642D Data sheet ( Hoja de datos )

Número de pieza MCP1642D
Descripción 1 MHz Low-Voltage Start-Up Synchronous Boost Regulator
Fabricantes Microchip 
Logotipo Microchip Logotipo



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MCP1642B/D
1.8A Input Current Switch, 1 MHz Low-Voltage Start-Up
Synchronous Boost Regulator
Features
• Up to 96% Typical Efficiency
• 1.8A Typical Peak Input Current Limit:
- IOUT > 175 mA @ 1.2V VIN, 3.3V VOUT
- IOUT > 600 mA @ 2.4V VIN, 3.3V VOUT
- IOUT > 800 mA @ 3.3V VIN, 5.0V VOUT
- IOUT > 1A @ VIN > 3.6V, 5.0V VOUT
• Low Start-Up Voltage: 0.65V, typical 3.3V VOUT
@ 1 mA
• Low Operating Input Voltage: 0.35V, typical 3.3V
VOUT @ 1 mA
• Output Voltage Range:
- Reference Voltage, VFB = 1.21V
- 1.8V to 5.5V for the adjustable device option
- 1.8V, 3.0V, 3.3V and 5.0V for fixed VOUT
options
• Maximum Input Voltage VOUT < 5.5V
• PWM Operation: 1 MHz
- Low Noise, Anti-Ringing Control
• Power Good Open-Drain Output
• Internal Synchronous Rectifier
• Internal Compensation
• Inrush Current Limiting and Internal Soft-Start
• Selectable, Logic-Controlled Shutdown States:
- True Load Disconnect Option (MCP1642B)
- Input-to-Output Bypass Option (MCP1642D)
• Shutdown Current (All States): 1 µA
• Overtemperature Protection
• Available Packages:
- 8-Lead MSOP
- 8-Lead 2x3 DFN
Applications
• One, Two and Three-Cell Alkaline, Lithium
Ultimate and NiMH/NiCd Portable Products
• Single-Cell Li-Ion to 5V Converters
• PIC® MCU Power
• USB Emergency Backup Charger from Batteries
• Personal Medical Products
• Wireless Sensors
• Hand-Held Instruments
• GPS Receivers
• +3.3V to +5.0V Distributed Power Supply
General Description
The MCP1642B/D devices are compact,
high-efficiency, fixed-frequency, synchronous step-up
DC-DC converters. This family of devices provides an
easy-to-use power supply solution for applications
powered by either one-cell, two-cell, or three-cell
alkaline, Ultimate Lithium, NiCd, NiMH, one-cell Li-Ion
or Li-Polymer batteries.
Low-voltage technology allows the regulator to start-up
without high inrush current or output voltage overshoot
from a low voltage input. High efficiency is
accomplished by integrating the low-resistance
N-Channel Boost switch and synchronous P-Channel
switch. All compensation and protection circuitry are
integrated to minimize the number of external
components. An open-drain Power Good output is
provided to indicate when the output voltage is within
10% of regulation and facilitates the interface with an
MCU. For standby applications, MCP1642B provides a
“true output disconnect” from input to output while in
shutdown (EN = GND). An additional device option
(MCP1642D) is available and connects “input to output
bypass” while in shutdown. Both options consume less
than 1 µA of input current.
For the adjustable (ADJ) device options, the output
voltage is set by a small external resistor divider. Fixed
VOUT device options do not require external divider
resistors. Two package options, 8-lead MSOP and 8-
lead 2x3 DFN, are available.
Package Types
MCP1642B/D-xx
MSOP
MCP1642B/D-xx
2x3 DFN*
EN 1
NC 2
PG 3
VOUT 4
8 VIN
EN 1
8 VIN
7 SGND NC 2 EP 7 SGND
6 PGND PG 3 9 6 PGND
5 SW VOUT 4
5 SW
MCP1642B/D-ADJ
MSOP
MCP1642B/D-ADJ
2x3 DFN*
EN 1
VFB 2
PG 3
VOUT 4
8 VIN
EN 1
8 VIN
7 SGND VFB 2 EP 7 SGND
6 PGND PG 3 9 6 PGND
5 SW VOUT 4
5 SW
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2014 Microchip Technology Inc.
DS20005253A-page 1

1 page




MCP1642D pdf
MCP1642B/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym.
Min. Typ. Max. Units
Conditions
Maximum Duty Cycle
Switching Frequency
EN Input Logic High
EN Input Logic Low
EN Input Leakage Current
Power Good Threshold
Power Good Hysteresis
Power Good Output Low
Power Good Output Delay
Power Good Output
Response
DCMAX
fSW
VIH
VIL
IENLK
PGTHF
PGHYS
PGLOW
PGDELAY
PGRES
— 90
0.85 1.0
75
——
— 0.1
— 90
—3
— 0.4
— 600
— 250
1.15
20
% Note 5
MHz
% of VIN
% of VIN
µA
%
%
Note 5, IOUT = 65 mA,
for MCP1642B/D-50 VIN = 2.5V
IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
VEN = 1.2V
VFB Falling, Note 5
Note 5
V ISINK = 5 mA, VFB = 0V, Note 5
µs Note 5
µs Note 5
Power Good Input Voltage
Operating Range
VPG_VIN
0.9 —
5.5
V ISINK = 5 mA, VFB = 0V, Note 5
Power Good
Leakage Current
Soft Start Time
Thermal Shutdown
Die Temperature
PGLEAK
tSS
TSD
— 0.01
— 550
— 150
µA VPG = 5.5V,
VOUT in Regulation, Note 5
µs EN Low to High,
90% of VOUT, Note 4, Note 5
C Note 5
Die Temperature
Hysteresis
TSDHYS
— 35
C Note 5
Note 1: Resistive load, 1 mA.
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
4: 220resistive load, 3.3V VOUT (15 mA).
5: Determined by characterization, not production tested.
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C.
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Operating Ambient Temperature TA -40 —
Range
+85 °C Steady State
Storage Temperature Range
TA
-65
+150
°C
Maximum Junction Temperature
TJ
+150
°C Transient
Package Thermal Resistances
Thermal Resistance, 8L-MSOP
JA — 211
Thermal Resistance, 8L-2x3 DFN JA
68
— °C/W
— °C/W
2014 Microchip Technology Inc.
DS20005253A-page 5

5 Page





MCP1642D arduino
MCP1642B/D
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MCP1642B/D-XX MCP1642B/D-ADJ
MSOP, 2x3 DFN MSOP, 2x3 DFN Symbol
Description
1 1 EN Enable pin. Logic high enables operation. Do not allow this pin
to float.
2 — NC Not Connected.
— 2 VFB Reference Voltage pin. Connect VFB to an external resistor
divider to set the output voltage (for fixed VOUT options, this pin
is not connected).
3 3 PG Open-Drain Power Good pin. Indicates when the output voltage
is within regulation.
4 4 VOUT Boost Converter Output.
5 5 SW Boost and Rectifier Switch input. Connect boost inductor
between SW and VIN.
6 6 PGND Power Ground reference.
7 7 SGND Signal Ground reference.
8 8 VIN Input supply voltage. Local bypass capacitor required.
9 9 EP Exposed Thermal Pad (2x3 DFN only).
3.1 Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable device switching and lower quiescent current
while disabled. A logic high (>75% of VIN) will enable
the regulator output. A logic low (<20% of VIN) will
ensure that the regulator is disabled.
3.2 Feedback Voltage Pin (VFB)
The VFB pin is used to provide output voltage regulation
by using a resistor divider for the ADJ device option.
The typical feedback voltage will be 1.21V, with the
output voltage in regulation.
3.3 Power Good Pin (PG)
The Power Good pin is an open-drain output which can
be tied to VOUT using a pull-up resistor. It turns low
when VOUT drops below 10% of its nominal value.
3.4 Output Voltage Pin (VOUT)
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation for the “ADJ” option.
3.6 Power Ground Pin (PGND)
The power ground pin is used as a return for the
high-current N-Channel switch. The PGND and SGND
pins are connected externally.
3.7 Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated VREF and error amplifier. The SGND and
power ground (PGND) pins are connected externally.
3.8 Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.
3.9 Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
pins. They must be connected to the same electric
potential on the Printed Circuit Board (PCB).
3.5 Switch Node Pin (SW)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 1.8A peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are
internally connected at the SW node.
2014 Microchip Technology Inc.
DS20005253A-page 11

11 Page







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