|
|
PDF MASW-004240-13170W Data sheet ( Hoja de datos )
| Número de pieza | MASW-004240-13170W | |
| Descripción | SP4T Surface Mount Silicon PIN Diode Switch | |
| Fabricantes | MA-COM | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MASW-004240-13170W (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
|
No Preview Available !
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Features
♦ Operating Freq. 10 ± 2GHz or 24 ± 2GHz
♦ Surface Mount Device
♦ Integrated Bias Network
♦ No Wire Bonds Required
♦ Low Current Consumption
+12 mA for On State/0V for Off Condition
♦ Rugged, Glass Encapsulated Construction
♦ Fully Monolithic
♦ Polymer Scratch Protection
♦ RoHS Compliant
Description
The MASW-004240-13170W is a surface mount
SP4T switch chip with integrated bias network. It
utilizes M/A-COM technology Solutions HMICTM
(Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310, which allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in
low loss, low dispersion glass. By using small
spacing between elements, this combination of
silicon and glass gives HMIC devices low loss and
high isolation performance with exceptional
repeatability through low millimeter frequencies.
Patterned gold backside metal allows for manual
or re-flow soldering without the need for wire bond
connections to the RF and bias ports. The chip
may be soldered using 80Au/20Sn, RoHS
compliant solders or electrically conductive silver
epoxy. The RF bond pads are labeled J1-J5 and
are 375x375µM (15x15mils) square. The DC bias
bond pads are labeled B2-B5 and are also
375x375µM (15x15mils) square.
Yellow areas denote backside soldering points
for bias and RF connections.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Absolute Maximum
-65oC to +125oC
-65oC to +150oC
+175oC
Applied Forward Current
+40mA
RF Incident Power
+30dBm C.W.
Mounting Temperature +280oC for 10 Seconds
Applications
The MASW-004240-13170W has been designed for
24GHz automotive radar sensor applications and is
also ideally suited for use at 10GHz. The switch is
turned on by applying a forward current of +12mA
at 4V to the appropriate bias port and is turned off at
0V. The RF bias network has been incorporated into
the design for ease of use and space
considerations.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
1 page  
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
Chip Dimensions and Pad Locations1,2,3
V1
Chip Dimensions
Dim
Mils
Min.
Max
Millimeters
Min.
Max
A 132.0 134.0 3.350 3.400
B 128.5 129.0 3.270 3.280
C 4.0 6.0 0.102 0.152
D 67.0 71.0 0.170 0.180
E 14.5 15.0 0.370 0.380
F 43.3 43.7 1.100 1.110
G 28.3 28.7 0.720 0.730
H 9.5 10.0 0.245 0.255
R.F. & DC ground
Bond Pad Centers
Mils
Dim X
Y
Millimeters
XY
J1 0 -57 0 -1.450
J2 -57 -57 1.450 -1.450
J3 57 57 1.450 1.450
J4 -57 57 -1.450 1.450
J5 -57 -57 -1.450 -0.145
B2 -57 15 1.450 0.380
B3 12 57 0.313 1.450
B4 -12 57 -0.313 1.450
B5 -57 15 -1.450 0.380
Notes:
1. Backside metallization thickness is.01µM.
2. Hatched areas indicate backside ohmic gold contacts
3. Bond pad centers are referenced from chip center.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MASW-004240-13170W.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MASW-004240-13170W | SP4T Surface Mount Silicon PIN Diode Switch | MA-COM |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |