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PDF XR1011-BD Data sheet ( Hoja de datos )
| Número de pieza | XR1011-BD | |
| Descripción | Receiver | |
| Fabricantes | Mimix Broadband | |
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4.5-10.5 GHz GaAs MMIC
Receiver
September 2009 - Rev 11-Sep-09
R1011-BD
Features
Integrated LNA, Mixer and LO Buffer Amp
1.6 dB Noise Figure
14.0 dB Conversion Gain
BCB Coated Die
100% RF, DC and NF Testing
100% Commercial-Level Visual Inspection Using
Mil-Std-883 Method 2010
General Description
Mimix Broadband’s 4.5-10.5 GHz receiver has a noise figure of
1.6 dB and 14.0 dB conversion gain across the band. The device
integrates an LNA, image reject mixer and LO buffer amplifier
within a single, compact MMIC.The image reject mixer
eliminates the need for a bandpass filter after the LNA to
remove thermal noise at the image frequency. I and Q mixer
outputs are provided and an external 90 degree hybrid is
required to select the desired sideband.This device uses Mimix
Absolute Maximum Ratings1
Supply Voltage (Vdd)
+4.3 VDC
Supply Current (Idd)
180 mA
Gate Voltage (Vgg)
-3 V
Max Power Dissipation (Pdiss) 750 mW
RF Input Power (Pin)
+14 dBm
LO Input Power (Pin)
+15 dBm
Operating Temperature (Ta) -55 to +85 ºC
Storage Temperature (Tstg) -65 to +165 ºC
Broadband’s GaAs PHEMT device model technology, and is
based upon electron beam lithography to ensure high
repeatability and uniformity.This device is well suited for
Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Channel Temperature (Tch) 175 °C
(1) Operation of this device above any one of these parameters
may cause permanent damage
(2) Channel temperature directly affects a device’s MTTF.
Channel temperature should be kept as low as possible to
maximize lifetime
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Units Min. Typ. Max.
Frequency Range (RF/LO)
GHz 4.5
- 10.5
Frequency Range (IF)
GHz DC - 3.5
Conversion Gain (CG)
dB
12.05
14.0
Noise Figure (NF)
dB 1.6 2.05
Input Third Order Intercept (IIP3)
dBm 2.0
Image Rejection
LO Input Drive
dBc
dBm
13.05
20.0
5.0
LO/RF Isolation
dB 50.0
RF Input Return Loss
dB 10.0
LO Input Return Loss
IF Input Return Loss
dB 10.0
dB 10.0
Drain Bias Voltage (Vd1,2,3)
Gate Bias Voltage (Vg1,2,3)3
Gate Bias Voltage (Vg4)4
VDC 4.0 4.0
VDC -1.2 -0.3 0.2
VDC -2.0
Supply Current (Id1)
mA 25.0
Supply Current (Id2)
mA 45.0
Supply Current (Id3)
mA 60.0
Supply Current (Ig4)
mA
(3) Vg1,2 and 3 are adjusted to achieve constant drain current regulation.
(4) Vg4 provides mixer bias and is fixed at -2.0V.
(5) 100% RF tested at 6.5-8.5 GHz.
2.0
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice. ©2009 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
1 page  
4.5-10.5 GHz GaAs MMIC
Receiver
September 2009 - Rev 11-Sep-09
R1011-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-
products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product.This product must be discarded in accordance
with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to
enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible.The mounting surface should
be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured
in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the
die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy
Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately
0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and
provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended.The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided).The work station
temperature should be 310º C +/- 10º C. Exposure to these extreme temperatures should be kept to minimum.The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided.Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Ordering Information
Part Number for Ordering
XR1011-BD-000V
XR1011-BD-EV1
Description
“V” - vacuum release gel paks
XR1011 die evaluation module
Caution: ESD Sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Proper ESD procedures should be followed when handling this device.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 5
Characteristic Data and Specifications are subject to change without notice. ©2009 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
5 Page | ||
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| PDF Descargar | [ Datasheet XR1011-BD.PDF ] | |
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