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MADP-030015-1314 fiches techniques PDF

MA-COM - PIN Diodes

Numéro de référence MADP-030015-1314
Description PIN Diodes
Fabricant MA-COM 
Logo MA-COM 





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MADP-030015-1314 fiche technique
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Features
0603 Outline
Surface Mount
15µm I-Region Length Devices
No Wirebonds Required
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions patented
HMICTM process. This device features two silicon pedes-
tals embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and connec-
tions to the backside of the device are facilitated by mak-
ing the pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This vertical topology provides for excep-
tional heat transfer. The topside is fully encapsulated
with silicon nitride and has an additional polymer layer for
scratch and impact protection. These protective coatings
prevent damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, 50dBm/C.W. or where the
peak power is 75dBm, pulse width is 1μS, and duty
cycle is 0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings1 @TAMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
500 mA
Reverse Voltage
- 115 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55 °C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
50dBm
Mounting Temperature
+280°C for 30 seconds
1) Exceeding these limits may cause in permanent damage
Rev. V6
Case Style ODS 1314
Chip Dimensions
DIM INCHES
MM
Min Max Min Max
A 0.060 0.062 1.525 1.575
B 0.031 0.032 0.775 0.825
C 0.004 0.008 0.102 0.203
D 0.019 0.021 0.475 0.525
E 0.019 0.021 0.475 0.525
F 0.019 0.021 0.475 0.525
G 0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifica-
tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data
may be available. Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.

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