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PDF UYGT801-S Data sheet ( Hoja de datos )
| Número de pieza | UYGT801-S | |
| Descripción | LED | |
| Fabricantes | Seoul Semiconductor | |
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Specification
UYGT801-S
SSC
Drawn
Approval
Customer
Approval
Rev. 00
September 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
1 page  
2. Absolute maximum ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
Pd
IF
IFM *2
VR
Topr
Tstg
Value
75
30
90
5
-40 ~ +100
-40 ~ +100
Unit
mW
mA
mA
V
oC
oC
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
[2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio.
[3] LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
3. Electro-Optical characteristics
Parameter
Forward Voltage
Reverse Current
Luminance Intensity *1
Peak Wavelength
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle *2
Symbol
VF
IR
IV
λP
λd
Δλ
2θ ½
Condition
IF =20mA
VR=5V
IF =20mA
IF =20mA
IF =20mA
IF =20mA
IF =20mA
Min
1.7
-
30
-
568
-
-
Typ Max Unit
2.1 2.5
V
- 10 μA
90 105 mcd
576 - nm
572 574
nm
18 - nm
120 - deg.
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
*3. A tolerance of ±0.05V on forward voltage measurements
Rev. 00
September 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
5 Page 
9. soldering
(1) Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition 10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 oC Max.
10 sec. Max.
Pre-heating
120~150 oC
60sec. Max.
Above 200oC
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 oC / sec.
Lead-frame Solder
1~5 oC / sec.
260 oC Max.
10 sec. Max.
Pre-heating
150~200 oC
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
Rev. 00
September 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet UYGT801-S.PDF ] | |
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