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PDF H3LIS200DL Data sheet ( Hoja de datos )
| Número de pieza | H3LIS200DL | |
| Descripción | MEMS motion sensor | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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H3LIS200DL
MEMS motion sensor:
low-power high-g 3-axis digital accelerometer
Datasheet - production data
TFLGA 3x3x1.0 mm3 16L
Features
Wide supply voltage, 2.16 V to 3.6 V
Low-voltage compatible IOs, 1.8 V
Ultra-low power consumption down to 10 μA in
low-power mode
±100g/±200g dynamically selectable full scales
I2C/SPI digital output interface
8-bit data output
Sleep-to-wakeup function
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Description
The H3LIS200DL is a low-power high-
performance 3-axis linear accelerometer
belonging to the “nano” family, with digital I2C/SPI
serial interface standard output.
The device features ultra-low-power operational
modes that allow advanced power saving and
smart sleep-to-wakeup functions.
The H3LIS200DL has dynamically user-
selectable full scales of ±100g/±200g and is
capable of measuring accelerations with output
data rates from 0.5 Hz to 1 kHz.
The H3LIS200DL is available in a small thin
plastic land grid array package (LGA) and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Applications
Shock detection
Impact recognition and logging
Order codes
H3LIS200DLTR
Table 1. Device summary
Temperature range [C]
Package
-40 to +85
TFLGA 3x3x1.0 mm3 16L
Packaging
Tape and reel
April 2015
This is information on a product in full production.
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H3LIS200DL
List of tables
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
INT2_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
INT2_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
INT2_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
INT2_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
INT2_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
INT2_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
TFLGA 3x3x1.0 mm3 16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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H3LIS200DL
Mechanical and electrical specifications
2.3
2.3.1
Communication interface characteristics
SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Symbol
Table 5. SPI slave timing values
Parameter
Value (1)
Min.
Max.
Unit
tc(SPC)
SPI clock cycle
100 ns
fc(SPC)
SPI clock frequency
10 MHz
tsu(CS)
CS setup time
6
th(CS)
CS hold time
8
tsu(SI)
SDI input setup time
5
th(SI)
SDI input hold time
15 ns
tv(SO)
SDO valid output time
50
th(SO)
SDO output hold time
9
tdis(SO)
SDO output disable time
50
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3. SPI slave timing diagram (2)
2. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
3. When no communication is ongoing, data on CS, SPC, SDI and SDO are driven by internal pull-up resistors.
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