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PDF BGA751N7 Data sheet ( Hoja de datos )
| Número de pieza | BGA751N7 | |
| Descripción | SiGe Bipolar 3G/3.5G/4G Single-Band LNA | |
| Fabricantes | Infineon | |
| Logotipo |  |
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BGA751N7
SiGe Bipolar 3G/3.5G/4G Single-Band LNA
Data Sheet
Revision 3.1, 2013-01-31
RF & Protection Devices
1 page  
BGA751N7
SiGe Bipolar 3G/3.5G/4G Single-Band LNA
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Block Diagram of Single-Band LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Application Board Layout on 3-layer FR4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Cross-Section view of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Detail of Application Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Footprint Recommendation 1 for the TSNP-7-1 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Footprint Recommendation 2 for the TSNP-7-1 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Package Outline (top, side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Tape & Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Marking Pattern (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Data Sheet
5 Revision 3.1, 2013-01-31
5 Page 
BGA751N7
SiGe Bipolar 3G/3.5G/4G Single-Band LNA
Electrical Characteristics
2.7 Supply Current Characteristics
Supply current and Power gain high gain mode versus reference resistor RREF (low gain mode supply current is
independent of reference resistor).
Note: In order to achieve higher gain an external reference resistor can be soldered between RREF (Pin 5) and
ground (see Figure 3.4 on Page 32).
Supply Current ICC = f (RREF)
VCC = 2.8 V, TA = 25 °C
Power Gain |S21| = f (RREF)
VCC = 2.8 V, TA = 25 °C
7
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1
10
R
REF
[kΩ]
100
18
17.5
17
16.5
16
15.5
15
10
100
R
REF
[kΩ]
1000
Data Sheet
11 Revision 3.1, 2013-01-31
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet BGA751N7.PDF ] | |
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