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PDF RClamp3328P Data sheet ( Hoja de datos )
| Número de pieza | RClamp3328P | |
| Descripción | 8-Line ESD Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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PROTECTION PRODUCTS - RailClamp®
Description
The RClamp®3328P provides low voltage ESD protec-
tion for high-speed ports. It features a high maximum
ESD withstand voltage of ±25kV contact and ±30kV
air discharge per IEC 61000-4-2. RClamp3328P is
designed to minimize both the ESD peak clamping and
the TLP clamping. Peak ESD clamping voltage is
extremely low and approximately the same at each pin.
The dynamic resistance is among the industry’s lowest
at 0.35 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF. This allows the
RClamp3328P to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to eight lines (four high-speed pairs).
The RClamp3328P is in a 9-pin SGP3810N9 package. It
measures 3.8 x 1.0mm with a nominal height of 0.50mm.
Intra-pair lead pitch is 0.40mm while the pair-to-pair pitch
is 0.5mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
Dimensions
RClamp3328P
Low Capacitance RClamp®
8-Line ESD Protection
PRELIMINARY
Features
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects eight high-speed lines
Low capacitance: 0.65pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SGP3810N9 9-pin package (3.8 x 1.0 x 0.50mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.4mm (intra-pair), 0.50mm (pair-to-
pair)
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
HDMI 1.3/1.4
V-By-One
USB 3.0
eDP
MHL
LVDS Interfaces
eSATA Interfaces
Circuit Diagram
3.80
0.40 BSC
0.50 BSC
1.00
0.50
Nominal Dimensions in mm (Bottom View)
Revision 7/18/2013
1
124
5
6
7 89
3
8-Line Protection
www.semtech.com
1 page  
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. Semtech's recommended assem-
bly guidelines for mounting this device are shown in
the Table. The figure below details Semtech’s recom-
mended aperture based on the below recommenda-
tions. Note that these are only recommendations and
should serve only as a starting point for design since
there are many factors that affect the assembly
process. The exact manufacturing parameters will
require some experimentation to get the desired
solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
RClamp3328P
PRELIMINARY
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
0.700
0.350
0.250
Stencil Opening
Land Pad ( Follow Drawing)
1.000
3.800
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
© 2013 Semtech Corporation
5
www.semtech.com
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet RClamp3328P.PDF ] | |
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