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PDF HEF4794B Data sheet ( Hoja de datos )
| Número de pieza | HEF4794B | |
| Descripción | 8-stage shift-and-store register LED driver | |
| Fabricantes | Philips | |
| Logotipo |  |
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INTEGRATED CIRCUITS
DATA SHEET
HEF4794B
8-stage shift-and-store register
LED driver
Product specification
Supersedes data of 1994 Jul 01
File under Integrated Circuits, IC04
1999 Jun 30
1 page  
Philips Semiconductors
8-stage shift-and-store register LED driver
Product specification
HEF4794B
AC POWER CHARACTERISTICS
VSS = 0 V; Tamb = 25 °C; input transition times ≤ 20 ns; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL FORMULA FOR P (µW)(1)
P
dynamic power dissipation per
VDD = 5 V
package
VDD = 10 V
1200fi + Σ ( foCL) × VD2 D
5550fi + Σ ( foCL) × VD2 D
VDD = 15 V
15000fi + Σ ( foCL) × VD2 D
Note
1. Where:
RL = ∞;
fi = input frequency (MHz);
fo = output frequency (MHz);
CL = load capacitance (pF);
Σ(foCL) = sum of outputs;
VDD = supply voltage (V).
AC TIMING CHARACTERISTICS
VSS = 0 V; Tamb = 25 °C; CL = 50 pF; input transition times ≤20 ns; unless otherwise specified.
SYMBOL
PARAMETER
VDD
(V)
MIN.
TYP.
MAX. UNIT
TYPICAL
EXTRAPOLATION
FORMULA
tPHL
propagation delay time CP to OS; 5
−
160 320 ns
132 ns + (0.55 ns/pF)CL
HIGH-to-LOW
10 −
65 130 ns 53 ns + (0.23 ns/pF)CL
15 −
45 90 ns 37 ns + (0.16 ns/pF)CL
tPLH
propagation delay time CP to OS; 5
−
130 260 ns
102 ns + (0.55 ns/pF)CL
LOW-to-HIGH
10 −
55 110 ns 44 ns + (0.23 ns/pF)CL
15 −
40 80 ns 32 ns + (0.16 ns/pF)CL
tPHL
propagation delay time CP to OS'; 5
−
120 240 ns
92 ns + (0.55 ns/pF)CL
HIGH-to-LOW
10 −
50 100 ns 39 ns + (0.23 ns/pF)CL
15 −
40 80 ns 32 ns + (0.16 ns/pF)CL
tPLH
propagation delay time CP to OS'; 5
−
130 260 ns
102 ns + (0.55 ns/pF)CL
LOW-to-HIGH
10 −
60 120 ns 49 ns + (0.23 ns/pF)CL
15 −
45 90 ns 37 ns + (0.16 ns/pF)CL
tPZL
propagation delay time CP to On; 5
−
240 480 ns
note 1
OFF-to-LOW
10 −
80 160 ns
15 −
55 110 ns
tPLZ
propagation delay time CP to On; 5
−
170 340 ns
note 1
LOW-to-OFF
10 −
75 150 ns
15 −
60 120 ns
1999 Jun 30
5
5 Page 
Philips Semiconductors
8-stage shift-and-store register LED driver
Product specification
HEF4794B
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jun 30
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet HEF4794B.PDF ] | |
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