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PDF BLF174XRS Data sheet ( Hoja de datos )
| Número de pieza | BLF174XRS | |
| Descripción | Power LDMOS transistor | |
| Fabricantes | NXP Semiconductors | |
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BLF174XR; BLF174XRS
Power LDMOS transistor
Rev. 1 — 25 June 2013
Product data sheet
1. Product profile
1.1 General description
A 600 W extremely rugged LDMOS power transistor for broadcast and industrial
applications in the HF to 128 MHz band.
Table 1. Application information
Test signal
f
(MHz)
CW 108
pulsed RF
108
VDS
PL
Gp
D
(V) (W) (dB) (%)
50
600 28.5
74
50 600 29
73
1.2 Features and benefits
Easy power control
Integrated ESD protection
Excellent ruggedness
High efficiency
Excellent thermal stability
Designed for broadband operation (HF to 128 MHz)
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
Industrial, scientific and medical applications
Broadcast transmitter applications
1 page  
NXP Semiconductors
BLF174XR; BLF174XRS
Power LDMOS transistor
7.3 Test circuit
PP
PP
PP
& /
&
& /
/
&
&
/ &
7
&
&
5
&
/
&
&
5
&
&
/ &
&
&
7
&
& &
&
/
&
&
&
&
&
&
/
& &
PP
PP
PP
Fig 3.
Printed-Circuit Board (PCB): RF 35; r = 3.5; thickness = 0.765 mm; thickness copper plating = 35 m.
See Table 10 for a list of components.
Component layout for class-AB production test circuit
DDD
Table 10. List of components
For test circuit see Figure 3.
Component
Description
Value
Remarks
C1, C2
multilayer ceramic chip capacitor 910 pF
[1]
C3
multilayer ceramic chip capacitor 51 pF
[2]
C4
multilayer ceramic chip capacitor 43 pF
[1]
C5
multilayer ceramic chip capacitor 100 pF
[1]
C6
multilayer ceramic chip capacitor 75 pF
[1]
C7, C8, C15, C16 multilayer ceramic chip capacitor 820 pF
[1]
C9, C10
multilayer ceramic chip capacitor 4.7 F, 100 V
TDK
C5750X7R2A475KT
C11, C12
electrolytic capacitor
470 F, 63 V
C13, C14
multilayer ceramic chip capacitor 4.7 F, 100 V
C17, C18, C19,
C20
multilayer ceramic chip capacitor 39 pF
[1]
C21, C23
multilayer ceramic chip capacitor 22 pF
[1]
C22
multilayer ceramic chip capacitor 15 pF
[1]
C24
multilayer ceramic chip capacitor 20 pF
[1]
C25, C26
multilayer ceramic chip capacitor 27 pF
[1]
C27, C28
multilayer ceramic chip capacitor 1 nF
[2]
L1, L2, L3, L4
1.5 turn 0.8 mm copper wire
D = 3.6 mm,
length = 1.8 mm
BLF174XR_BLF174XRS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 June 2013
© NXP B.V. 2013. All rights reserved.
5 of 13
5 Page 
NXP Semiconductors
BLF174XR; BLF174XRS
Power LDMOS transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
BLF174XR_BLF174XRS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 June 2013
© NXP B.V. 2013. All rights reserved.
11 of 13
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| PDF Descargar | [ Datasheet BLF174XRS.PDF ] | |
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