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PDF BIT3260 Data sheet ( Hoja de datos )
| Número de pieza | BIT3260 | |
| Descripción | High Performance PWM Controller | |
| Fabricantes | Beyond Innovation Technology | |
| Logotipo |  |
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 1. - Low Cost LED Driver  Hay una vista previa y un enlace de descarga de BIT3260 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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Beyond Innovation Technology Co., Ltd.
High Performance PWM Controller
Version: A1
2012/02/06
Confidential
This is an ONE-TIME copy. Updates will not be provided
page 1 of 7
1 page  
Beyond Innovation Technology Co., Ltd.
Soldering Information
Reflow Soldering:
The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is
used and the package is not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small
amount of moisture in them can cause cracking of the plastic body. Preheating is necessary to dry the paste and
evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to
the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface
temperature of the packages should preferable be kept below 245 °C for thick/large packages (packages with a thickness
¡ 2.5 mm or with a volume ¡ 350 mm3 so called thick/large packages). The top-surface temperature of the
packages should preferable be kept below 260 °C for thin/small packages (packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called thin/small packages).
Stage
1’st Ram Up Rate
Preheat
2’nd Ram Up
Solder Joint
Peak Temp
Ram Down rate
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Duration
-
60~180 sec
-
60~150 sec
20~40 sec
-
Temp (§ )
260
217
200
150
25
RT
60~ 180
60~150
Time(sec)
Wave Soldering:
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and non-wetting can present major problems.
Manual Soldering:
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering
iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
2012/02/06
Confidential
This is an ONE-TIME copy. Updates will not be provided
page 5 of 7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet BIT3260.PDF ] | |
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