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PDF S5870 Data sheet ( Hoja de datos )
| Número de pieza | S5870 | |
| Descripción | Si PIN photodiode | |
| Fabricantes | Hamamatsu Corporation | |
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PHOTODIODE
Si PIN photodiode
S5980, S5981, S5870
Multi-element photodiodes for surface mounting
Features
l Large active area
S5980: 5 × 5 mm
S5981: 10 × 10 mm
S5870: 10 × 10 mm
l Chip carrier package suitable for surface mounting
Facilitates automated surface mounting by solder reflow
l Thin package: 1.26 mmt
l Photo sensitivity: 0.72 A/W (λ=960 nm)
s General ratings
Parameter
Window material
Gap between elements
Active area
Symbol
-
-
A
S5980
5.0/4 elements
Applications
l Laser beam axis alignment
l Level meters
l Pointing devices, etc.
S5981
Resin coating
30
10.0/4 elements
S5870
10.0/2 elements
Unit
-
µm
mm
s Absolute maximum ratings
Parameter
Symbol
Reverse voltage VR Max.
O perating tem perature Topr
Storage temperature Tstg
S5980
S5981
30
-40 to +100
-40 to +125
S5870
Unit
V
°C
°C
s Electrical and optical characteristics (Ta=25 °C, per 1 element)
Parameter
Symbol
Condition
S5980
Typ. Max.
Spectral response range λ
320 to 1100
-
Peak sensitivity
wavelength
λp
960 -
Photo sensitivity
S λ=λp
0.72 -
Dark current
ID VR=10 V
0.3 2
Tem perature coefficient of ID TCID
1.15 -
Cut-off frequency
fc VR=10 V, RL=50 Ω, -3 dB 25
-
Term inal capacitance Ct VR=10 V, f=1 MHz
10
-
N oise equivalent power NEP VR=10 V, λ=λp
1.4 × 10-14
-
Note) S5980: For mass production, order unit is 100 pieces.
S5981, S5870: For mass production, order unit is 50 pieces.
S5981
Typ. Max.
320 to 1100
-
960 -
0.72
0.6
1.15
20
35
1.9 × 10-14
-
4
-
-
-
-
S5870
Typ. Max.
320 to 1100
-
960 -
0.72
2
1.15
10
50
3.5 × 10-14
-
10
-
-
-
-
Unit
nm
nm
A/W
nA
times/°C
MHz
pF
W/Hz1/2
Precautions for use
q The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
q Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
q Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
q Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.
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| PDF Descargar | [ Datasheet S5870.PDF ] | |
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