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PDF NDF04N60Z Data sheet ( Hoja de datos )

Número de pieza NDF04N60Z
Descripción N-Channel Power MOSFET / Transistor
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NDF04N60Z Hoja de datos, Descripción, Manual

NDF04N60Z, NDD04N60Z
N-Channel Power MOSFET
600 V, 2.0 W
Features
Low ON Resistance
Low Gate Charge
ESD DiodeProtected Gate
100% Avalanche Tested
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Parameter
Symbol NDF NDD Unit
DraintoSource Voltage
Continuous Drain Current RqJC (Note 1)
Continuous Drain Current RqJC, TA =
100°C (Note 1)
VDSS
ID
ID
600
4.8 4.1
3.0 2.6
V
A
A
Pulsed Drain Current,
VGS @ 10V
Power Dissipation RqJC
GatetoSource Voltage
Single Pulse Avalanche Energy, ID = 4.0
A
IDM
PD
VGS
EAS
20 20 A
30 83
±30
120
W
V
mJ
ESD (HBM) (JESD22A114)
RMS Isolation Voltage
(t = 0.3 sec., R.H. 30%, TA = 25°C)
(Figure 15)
Vesd
VISO
3000
4500
V
V
Peak Diode Recovery (Note 2)
dV/dt
4.5 V/ns
MOSFET dV/dt
dV/dt
60 V/ns
Continuous Source Current
(Body Diode)
IS 4.0 A
Maximum Temperature for Soldering
Leads
TL
260 °C
Operating Junction and
Storage Temperature Range
TJ, Tstg
55 to 150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Limited by maximum junction temperature
2. ISD = 4.0 A, di/dt 100 A/ms, VDD BVDSS, TJ = +150°C
www.onsemi.com
VDSS (@ TJmax)
650 V
RDS(on) (MAX) @ 2 A
2.0 Ω
NChannel
D (2)
G (1)
S (3)
1 23
NDF04N60ZG,
NDF04N60ZH
TO220FP
CASE 221AH
4
4
1 23
NDD04N60Z1G
IPAK
CASE 369D
12
3
NDD04N60ZT4G
DPAK
CASE 369AA
ORDERING AND MARKING INFORMATION
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
January, 2015 Rev. 9
1
Publication Order Number:
NDF04N60Z/D

1 page




NDF04N60Z pdf
NDF04N60Z, NDD04N60Z
TYPICAL CHARACTERISTICS
10
50% (DUTY CYCLE)
1.0 20%
10%
5.0%
2.0%
0.1
1.0%
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1 1.0
PULSE TIME (s)
Figure 13. Thermal Impedance for NDF04N60Z
10
1.0 50% (DUTY CYCLE)
20%
10%
0.1 5.0%
2.0%
1.0%
0.01 SINGLE PULSE
0.001
0.000001 0.00001
0.0001
0.001
0.01
0.1 1.0
PULSE TIME (s)
Figure 14. Thermal Impedance for NDD04N60Z
RqJC = 4.2°C/W
Steady State
10 100 1000
RqJC = 1.5°C/W
Steady State
10 100 1000
LEADS
HEATSINK
0.110MIN
Figure 15. Mounting Position for Isolation Test
Measurement made between leads and heatsink with all leads shorted together.
*For additional mounting information, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5

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