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PDF A711 Data sheet ( Hoja de datos )
| Número de pieza | A711 | |
| Descripción | 1.1A HIGH VOLTAGE ADJUSTABLE CURRENT REGULATOR | |
| Fabricantes | ADDtek | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de A711 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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www.addmtek.com
DESCRIPTION
The A711 is a high voltage, low dropout current
regulator for high power LED, that the maximum output
current can be up to 1.1Amp. The output current was
decided by an external resistor. The output sink current
could be disabled via OE pin. PWM dimming function
could also be controlled by OE pin.
TO-263 package is available for good power
dissipation ability. Build-in thermal protection to prevent
the chip from over heat damage, and adequate thermal
pad PCB area is required to control the junction
temperature below 125°C.
TYPICAL APPLICATION CIRCUIT
5V~50V
CBP
Enable/
PWM Dimming
RSET
OE
ISET
VDD
A711
GND
OUT
CO
A711
1.1A HIGH VOLTAGE
ADJUSTABLE CURRENT REGULATOR
WITH ENABLE CONTROL
FEATURES
0.8V Output Drop-out Voltage at 1.1Amp.
1.1Amp. Maximum Output Current.
Output Current Controlled by External Resistor.
3us Fast Response Output Stage Enable Control.
Output Pin Sustain Voltage Up To 75V.
Supply Voltage Range 5V~50V.
TO-263-5L package.
APPLICATIONS
High Power LED Driver
RGB Full Color Power LED driver
LCD Monitor/TV LED Backlight Driver
LED Lighting
LED Street Lamp / Table Lamp
PACKAGE PIN OUT
5
4
3
2
1
TO-263-5L
(Top View)
OUT
OE
GND
ISET
VDD
5 OUT
4 OE
3 GND
2 ISET
1 VDD
TO-252-5L
(Top View)
5 OUT
4 OE
3 GND
2
TO-220-5L
ISET
1 VDD (Top View)
ORDER INFORMATION
V
TO-263-5L
5 pin
P
TO-220-5L
5 pin
S
A711VFT
A711PFT
Note:
Part Number: A 7 1 1 □ □ □
Package Type. V: TO-263-5L
P: TO-220-5L
S: TO-252-5L
Packing.
T: Tape & Reel
Package Process. F: Lead Free; G: Green
TO-252-5L
5 pin
A711SGT
Copyright © 2008 ADDtek Corp.
1 DD084_B -- DECEMBER 2008
1 page  
CHARACTERIZATION CURVES
A711
Supply Current vs. Supply Voltage
6.0
5.0 IOUT=1100mA
4.0 IOUT=900mA
IOUT=700mA
3.0
IOUT=500mA
2.0 IOUT=330mA
1.0
0.0
0
VDROP=0.8V
TA=25°C
20 40 60
Supply Voltage (V)
Output Current vs. Supply Voltage
1200
1000
IOUT=1100mA
800
IOUT=900mA
600
IOUT=700mA
400
IOUT=500mA
200
0
0
VDROP=1V
TA=25°C
IOUT=330mA
20 40
Supply Voltage (V)
60
RSET vs. Output Current
2
1.5
1
0.5
0
300
V DROP =1V
TA=25°C
500 700 900
Output Current (mA)
1100
ISET Voltage vs. Junction Temperature
1.50
1.40
1.30
1.20
1.10
1.00
-50
VDD=24V
0 50 100
Junction Temperature (°C)
150
Output Current vs. Dropout Voltage
1200
1000
VDD=24V
TA=25°C
IOUT=1100mA
800
IOUT=900mA
600
400
200
I O UT =700m A
IOUT=500mA
IOUT=330mA
0
0.00
1.00 2.00
Dropout Voltage (V)
3.00
Copyright © 2008 ADDtek Corp.
5 DD084_B -- DECEMBER 2008
5 Page 
A711
THERMAL CONSIDERATION
The Maximum Power Dissipation on Current Regulator
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IDD
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IDD = the quiescent current the regulator consumes at IOUT(NOM);
VIN(MAX) = the maximum input voltage.
Thermal Consideration
The A711 has internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of A711 prevents the device from damage due to excessive power dissipation.
When the device junction temperature rises to approximately 160°C, the regulator will be turned off. When power
consumption is over about 1.22W (TO-263 and TO-220 package, at TA=70°C), additional heat sink is required to
control the junction temperature below 125°C.
The junction temperature is:
TJ = PD (θJT +θTS +θSA ) + TA
PD : Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
For TO-263 package, θJT = 3.0 oC /W.
θTS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θTS < 1.0°C /W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB θSA (°C /W)
PCB heat sink size (mm2)
59
500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
Thermal-pad of TO-263
Through hole vias
5 OUT
4 OE
3 GND
2 ISET
1 VDD
Copyright © 2008 ADDtek Corp.
11 DD084_B -- DECEMBER 2008
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet A711.PDF ] | |
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