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PDF IRFL4310PbF Data sheet ( Hoja de datos )

Número de pieza IRFL4310PbF
Descripción Power MOSFET ( Transistor )
Fabricantes International Rectifier 
Logotipo International Rectifier Logotipo



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PD - 95144
IRFL4310PbF
HEXFET® Power MOSFET
l Surface Mount
l Dynamic dv/dt Rating
l Fast Switching
l Ease of Paralleling
l Advanced Process Technology
l Ultra Low On-Resistance
l Lead-Free
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
G
D VDSS = 100V
RDS(on) = 0.20
ID = 1.6A
S
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
Absolute Maximum Ratings
S O T -2 2 3
Parameter
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V**
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V*
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V*
Pulsed Drain Current 
PD @TA = 25°C
PD @TA = 25°C
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
VGS Gate-to-Source Voltage
EAS
IAR
EAR
dv/dt
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
TJ, TSTG
Junction and Storage Temperature Range
Thermal Resistance
Max.
2.2
1.6
1.3
13
2.1
1.0
8.3
± 20
47
1.6
0.10
5.0
-55 to + 150
Parameter
Typ.
RθJA
RθJA
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
93
48
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
Max.
120
60
Units
A
W
W
mW/°C
V
mJ
A
mJ
V/ns
°C
Units
°C/W
1
04/22/04

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IRFL4310PbF pdf
IRFL4310PbF
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