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PDF SZESD1014 Data sheet ( Hoja de datos )
| Número de pieza | SZESD1014 | |
| Descripción | Low Capacitance ESD Protection Array | |
| Fabricantes | ON Semiconductor | |
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ESD1014, SZESD1014
Low Capacitance ESD
Protection Array for High
Speed Data Lines
Protection
The ESD1014 transient voltage suppressor is designed to protect
high speed data lines from ESD, EFT, and lightning.
Features
• Low Capacitance (6 pF Maximum Between I/O Lines and GND)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (ESD) Level 4 − 30 kV (Contact)
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• This is a Pb−Free Device
Typical Applications
• High Speed Communication Line Protection
• USB 1.1 and 2.0 Power and Data Line Protection
• Digital Video Interface (DVI)
• Monitors and Flat Panel Displays
• T1/E1 and T3/E3
• 10/100/1000 Ethernet Protection
• Gigabit Ethernet Protection
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Power Dissipation
Ppk 450 W
Maximum Peak Pulse Current
8 x 20 mS @ TA = 25°C
IPP 30 A
Operating Junction Temperature Range TJ −40 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Contact (ESD)
ESD
16000
400
30000
V
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
LOW CAPACITANCE
DIODE TVS ARRAY
PIN CONFIGURATION
AND SCHEMATIC
1 10
29
38
47
56
MARKING
DIAGRAM
UDFN10
CASE 517AN
1014
AYW
G
1014
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
ESD1014MUTAG
UDFN10
(Pb−Free)
SZESD1014MUTAG UDFN10
(Pb−Free)
Shipping†
3000 / Tape &
Reel
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 6
1
Publication Order Number:
ESD1014/D
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet SZESD1014.PDF ] | |
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