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PDF NRVTSS5100E Data sheet ( Hoja de datos )

Número de pieza NRVTSS5100E
Descripción Low Leakage Trench-based Schottky Rectifier
Fabricantes ON Semiconductor 
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NRVTSS5100E,
NRVTSAF5100E
Low Leakage Trench-based
Schottky Rectifier
Features
Fine Lithography Trenchbased Schottky Technology for Very Low
Forward Voltage and Low Leakage
Fast Switching with Exceptional Temperature Stability
Low Power Loss and Lower Operating Temperature
Higher Efficiency for Achieving Regulatory Compliance
High Surge Capability
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101
Qualified and PPAP Capable
These are PbFree and HalideFree Devices
Typical Applications
Switching Power Supplies including Wireless, Smartphone and
Notebook Adapters
High Frequency and DCDC Converters
Freewheeling and ORing diodes
Reverse Battery Protection
Instrumentation
LED Lighting
Mechanical Characteristics:
Case: Epoxy, Molded
Epoxy Meets Flammability Rating UL 940 @ 0.125 in.
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
www.onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
5 AMPERES
100 VOLTS
MARKING
DIAGRAMS
SMB
CASE 403A
AYWW
TE51G
G
SMAFL
CASE 403AA
STYLE 6
AYWW
E51G
G
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NRVTSS5100ET3G
Package
SMB
(PbFree)
Shipping
5000 /
Tape & Reel
NRVTSAF5100ET3G SMAFL
5000 /
(PbFree) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
January, 2015 Rev. 0
1
Publication Order Number:
NRVTSS5100E/D

1 page




NRVTSS5100E pdf
NRVTSS5100E, NRVTSAF5100E
PACKAGE DIMENSIONS
HE
E
bD
POLARITY INDICATOR
OPTIONAL AS NEEDED
SMB
CASE 403A03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS
DIM MIN
NOM MAX
A 1.95
2.30
2.47
A1 0.05
0.10
0.20
b 1.96 2.03 2.20
c 0.15 0.23 0.31
D 3.30
3.56
3.95
E 4.06
4.32
4.60
H E 5.21 5.44 5.60
L 0.76 1.02 1.60
L1 0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1 c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
ǒ ǓSCALE 8:1
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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