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PDF FDMS86103L Data sheet ( Hoja de datos )

Número de pieza FDMS86103L
Descripción N-Channel Shielded Gate PowerTrench MOSFET
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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FDMS86103L
N-Channel Shielded Gate PowerTrench® MOSFET
100 V, 49 A, 8 mΩ
October 2014
Features
General Description
„ Shielded Gate MOSFET Technology
„ Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 12 A
„ Max rDS(on) = 11 mΩ at VGS = 4.5 V, ID = 10 A
„ Advanced Package and Silicon combination for low rDS(on)
and high efficiency
This N-Channel MOSFET is produced using Fairchild
Semiconductor‘s advanced PowerTrench® process that
incorporates Shielded Gate technology. This process has been
optimized for the on-state resistance and yet maintain superior
switching performance.
„ MSL1 robust package design
„ 100% UIL tested
„ RoHS Compliant
Application
„ DC-DC Conversion
Top Bottom
Pin 1
S
S
S
G
S
S
D
D
D
D
D
D
Power 56
SD
GD
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
ID
EAS
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Continuous
-Pulsed
TC = 25 °C
TA = 25 °C
Single Pulse Avalanche Energy
Power Dissipation
TC = 25 °C
Power Dissipation
TA = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 3)
(Note 1a)
Ratings
100
±20
49
12
100
312
104
2.5
-55 to +150
Units
V
V
A
mJ
W
°C
RθJC
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
1.2
50
°C/W
Device Marking
FDMS86103L
Device
FDMS86103L
Package
Power 56
Reel Size
13 ’’
Tape Width
12 mm
Quantity
3000 units
©2010 Fairchild Semiconductor Corporation
FDMS86103L Rev.C2
1
www.fairchildsemi.com

1 page




FDMS86103L pdf
Typical Characteristics TJ = 25 °C unless otherwise noted
2
DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
0.2
0.1
0.05
0.1 0.02
0.01
PDM
0.01
SINGLE PULSE
RθJA = 125 oC/W
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
0.001
10-3
10-2
10-1
1
10 100
t, RECTANGULAR PULSE DURATION (sec)
Figure 13. Junction-to-Ambient Transient Thermal Response Curve
1000
©2010 Fairchild Semiconductor Corporation
FDMS86103L Rev.C2
5
www.fairchildsemi.com

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