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PDF 29F32B08NCMFS Data sheet ( Hoja de datos )
| Número de pieza | 29F32B08NCMFS | |
| Descripción | 64M20C Client Compute NAND Flash Memory | |
| Fabricantes | Intel | |
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Intel® 64M20C Client Compute NAND Flash
Memory
PF29F64G08LCMFS, PF29F16B08MCMFS, PF29F32B08NCMFS
Advance Datasheet
Product Features
Open NAND Flash Interface (ONFI) 3.0-compliant Command set: ONFI NAND Flash Protocol
Multi-level cell (MLC) technology
Advanced command set:
Organization
— Page size: 17,600 bytes (16,384 + 1216)
— Block size: 512 pages, (8,192K + 608K
bytes)
— Plane size: 2 planes x 512 blocks
Device size:
— 64 Gb: 1,024 blocks
— 128Gb: 2,048 blocks
— 256Gb: 4,096 blocks
Synchronous I/O performance
— Up to timing mode 6
— Clock rate: 6ns
— Read/write throughput per pin: 333 MT/s
Asynchronous I/O performance
— Up to asynchronous timing mode 5
— tRC/tWC: 20ns (MIN)
— Read/write throughput per pin: 50 MT/s
Array performance
— Read page: 65us (TYP), 110us (MAX)
— Program page: 1,250us (TYP)
— Erase block: 5ms (TYP)
— PAGE CACHE PROGRAM
— READ CACHE
(RANDOM, SEQUENTIAL, END)
— READ UNIQUE ID
— COPYBACK
— Multi-LUN operations
— Multi-plane commands
— Read unique ID
Copyback operations supported within the
plane that the data was read
First block (block address 00h) is valid when
shipped from factory.
RESET (FFh) required as first command after
power-on
Operation status byte provides software
method for detecting
— Operation completion
— Pass/fail condition
— Write-protect status
Data strobe (DQS) signals provide a hardware
method for synchronizing data DQ in the
synchronous interface
Operating Voltage Range
On-die Termination (ODT)
— VCC: 2.7–3.6V
Operating temperature: 0°C to +70°C
— VCCQ: 1.7–1.95V or 2.7–3.6V (Async only) Package: 132-ball BGA
Density
64Gb
128Gb
256Gb
Package
BGA
BGA
BGA
# of Die
SDP
DDP
QDP
1
2
4
# of CE#
and R/B#
1
2
4
Bus I/O
Configuration
Single x8
Dual x8
Dual x8
Device ID
89h, 64h, 64h, 3Ch, A1h, 00h, 00h, 00h
89h, 64h, 64h, 3Ch, A1h, 00h, 00h, 00h
89h, 64h, 64h, 3Ch, A1h, 00h, 00h, 00h
Intel Confidential
Document Number: 328959-001US
May 2013
1 page  
Intel® 64M20C Client Compute NAND Flash Memory
19.1
19.2
19.3
19.4
ERASE BLOCK (60h-D0h) ................................................................................. 104
ERASE BLOCK MULTI-PLANE (60h-D1h) ............................................................. 105
ERASE BLOCK MULTI-PLANE (60h-60h-D0h) ....................................................... 105
ERASE SUSPEND (61h) .................................................................................... 106
20.0 Copyback Operations ............................................................................................. 108
20.1 COPYBACK READ (00h-35h).............................................................................. 109
20.2 COPYBACK PROGRAM (85h–10h)....................................................................... 110
20.3 COPYBACK READ MULTI-PLANE (00h-32h).......................................................... 111
20.4 COPYBACK PROGRAM MULTI-PLANE (85h-11h) ................................................... 111
21.0 Multi-Plane Operations .......................................................................................... 112
22.0 Interleaved Die (Multi-LUN) Operations ................................................................ 113
23.0 Error Management................................................................................................. 114
24.0 Output Drive Impedance ....................................................................................... 115
25.0 AC Overshoot/Undershoot Specifications .............................................................. 118
26.0 Input Slew Rate..................................................................................................... 120
27.0 Output Slew Rate .................................................................................................. 121
28.0 Power Cycle Requirements .................................................................................... 122
29.0 Electrical Specifications ......................................................................................... 123
30.0 Electrical Specifications — DC Characteristics and Operating Conditions
(Asynchronous)..................................................................................................... 125
31.0 Electrical Specifications — DC Characteristics and Operating Conditions (VCCQ) ... 126
31.1 Single-Ended Requirements for Differential signals............................................... 127
32.0 Electrical Specifications — AC Characteristics and Operating Conditions (Onfi 2.3 and
Onfi 3.0)................................................................................................................ 131
33.0 Electrical Specifications — Array Characteristics.................................................... 140
34.0 Asynchronous Interface Timing Diagrams ............................................................. 141
35.0 Onfi 2.3 Interface Timing Diagrams ....................................................................... 152
36.0 Onfi 3.0 Interface Timing Diagrams ....................................................................... 171
37.0 Feature Address 94h: R/B# Configuration ............................................................. 190
38.0 Synchronous Clock Stop during Data Input............................................................ 192
39.0 References ............................................................................................................ 193
40.0 Glossary ................................................................................................................ 193
41.0 Revision History .................................................................................................... 194
May 2013
Document Number: 328959-001US
Intel® 64M20C Client Compute NAND Flash Memory
Advance Datasheet
5
5 Page 
Intel® 64M20C Client Compute NAND Flash Memory
Table 1.
BGA Signal Descriptions
Asynchronous
Symbol
Synchronous
Symbol
(ONFI 2.3)
R/B#[0:1]_0,
R/B#[0:1]_1
R/B#[0:1]_0,
R/B#[0:1]_1
VCC
VCCQ
VPP
VSS
VSSQ
-
NC
DNU
VCC
VCCQ
VPP
VSS
VSSQ
-
NC
DNU
Synchronous
Symbol
(ONFI 3.0)
R/B#[0:1]_0,
R/B#[0:1]_1
VCC
VCCQ
VPP
VSS
VSSQ
VREFQ_0,
VREFQ_1
NC
DNU
Type
Pin Function
Output
Ready/Busy
An open-drain, active-LOW output that uses an external pull-up
resistor. The pin is used to indicate when the chip is processing
a PROGRAM or ERASE operation. It is also used during a READ
operation to indicate when data is being transferred from the
array into the serial data register. Once these operations have
completed, R/B# returns to the high-impedance state.
Supply Core power supply
Supply I/O power supply
Optional external high-voltage power supply to the device. This
Supply high voltage power supply may be used to enhance operations
(for example, improve power efficiency).
Supply Ground connection
Supply Ground connection
Supply Reference voltage used with synchronous interface.
No Connect
– NC pins are not internally connected. These pins can be driven
or left unconnected.
Do Not Use
–
DNU pins must be left disconnected.
May 2013
Document Number: 328959-001US
Intel Confidential
Intel® 64M20C Client Compute NAND Flash Memory
Advance Datasheet
11
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