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PDF NVTFS4C10N Data sheet ( Hoja de datos )
| Número de pieza | NVTFS4C10N | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NVTFS4C10N
Power MOSFET
30 V, 7.4 mW, 47 A, Single N−Channel,
m8FL
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• NVTFS4C10NWF − Wettable Flanks Product
• NVT Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current RqJA
(Notes 1, 2, 4)
TA = 25°C
TA = 100°C
VDSS
VGS
ID
30
±20
15.3
10.8
V
V
A
Power Dissipation RqJA
(Notes 1, 2, 4)
Continuous Drain
Current RyJC
(Notes 1, 3, 4)
Steady
State
TA = 25°C
TA = 100°C
TC = 25°C
TC = 100°C
PD
ID
3.0 W
1.5
47 A
33
Power Dissipation
RyJC (Notes 1, 3, 4)
TC = 25°C
TC = 100°C
PD
28 W
14 W
Pulsed Drain Current
TA = 25°C, tp = 10 ms
IDM
196 A
Operating Junction and Storage Temperature
TJ, −55 to °C
Tstg +175
Source Current (Body Diode)
IS 53 A
Single Pulse Drain−to−Source Avalanche Energy
(TJ = 25°C, VGS = 10 V, IL = 10.2 A, L = 0.5 mH)
EAS
26 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Case (Drain) (Notes 1, 3)
Junction−to−Ambient – Steady State
(Notes 1, 2)
RyJC
RqJA
5.4
50 °C/W
1. The entire application environment impacts the thermal resistance values
shown; they are not constants and are valid for the specific conditions noted.
2. Surface−mounted on FR4 board using 650 mm2, 2 oz. Cu Pad.
3. Assumes heat−sink sufficiently large to maintain constant case temperature
independent of device power.
4. Continuous DC current rating. Maximum current for pulses as long as one
second is higher but dependent on pulse duration and duty cycle.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
7.4 mW @ 10 V
11 mW @ 4.5 V
ID MAX
47 A
N−Channel MOSFET
D (5−8)
G (4)
S (1,2,3)
1
WDFN8
(m8FL)
CASE 511AB
MARKING DIAGRAM
1
SD
S XXXX D
S AYWWG D
GGD
4C10
10WF
A
Y
WW
G
= Specific Device Code for
NVMTS4C10N
= Specific Device Code of
NVTFS4C10NWF
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 2
1
Publication Order Number:
NVTFS4C10N/D
1 page  
NVTFS4C10N
TYPICAL CHARACTERISTICS
100
Duty Cycle = 50%
10 20%
10%
5%
2%
1 1%
0.1
0.01
0.000001 0.00001
0.0001
RqJA Single Pulse
0.001
0.01
0.1
t, PULSE TIME (s)
Figure 12. Thermal Response
RyJC Single Pulse
yJC, Infinite Heat Sink Assumption
qJA, 650 mm2, 2 oz Cu Pad, Single
Layer on FR4
1 10 100 1000
60 100
50
40
30
20
10
0
0 10 20 30 40 50 60 70 80
ID (A)
Figure 13. GFS vs. ID
TJ(initial) = 25°C
TJ(initial) = 85°C
10
1
0.000001
0.00001
0.0001
0.001
TAV, TIME IN AVALANCHE (s)
Figure 14. Avalanche Characteristics
ORDERING INFORMATION
Device
Package
Shipping†
NVTFS4C10NTAG
WDFN8
(Pb−Free)
1500 / Tape & Reel
NVTFS4C10NWFTAG
WDFN8
(Pb−Free)
1500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NVTFS4C10N.PDF ] | |
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