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PDF NCV7381 Data sheet ( Hoja de datos )
| Número de pieza | NCV7381 | |
| Descripción | FlexRay Bus Driver | |
| Fabricantes | ON Semiconductor | |
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NCV7381
FlexRay) Bus Driver
NCV7381 is a single−channel FlexRay bus driver compliant with
the FlexRay Electrical Physical Layer Specification Rev. 3.0.1,
capable of communicating at speeds of up to 10 Mbit/s. It provides
differential transmit and receive capability between a wired FlexRay
communication medium on one side and a protocol controller and
a host on the other side.
NCV7381 mode control functionality is optimized for nodes
permanently connected to car battery.
It offers excellent EMC and ESD performance.
KEY FEATURES
General
• Compliant with FlexRay Electrical Physical Layer Specification
Rev 3.0.1
• FlexRay Transmitter and Receiver in Normal−power Modes for
Communication up to 10 Mbit/s
• Support of 60 ns Bit Time
• FlexRay Low−power Mode Receiver for Remote Wakeup Detection
• Excellent Electromagnetic Susceptibility (EMS) Level over Full
Frequency Range. Very Low Electromagnetic Emissions (EME)
• Bus Pins Protected against >10 kV System ESD Pulses
• Safe Behavior under Missing Supply or No Supply Conditions
• Interface Pins for a Protocol Controller and a Host
(TxD, RxD, TxEN, RxEN, STBN, BGE, EN, ERRN)
• INH Output for Control of External Regulators
• Local Wakeup Pin WAKE
• TxEN Time−out
• BGE Feedback
• Supply Pins VBAT, VCC, VIO with Independent Voltage Ramp Up:
♦ VBAT Supply Parametrical Range from 5.5 V to 50 V
♦ VCC Supply Parametrical Range from 4.75 V to 5.25 V
♦ VIO Supply Parametrical Range from 2.3 V to 5.25 V
• Compatible with 14 V and 28 V Systems
• Operating Ambient Temperature −40°C to +125°C (TAMB_Class1)
• Junction Temperature Monitoring with Two Levels
• SSOP−16 Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
FlexRay Functional Classes
• Bus Driver Voltage Regulator Control
• Bus Driver – Bus Guardian Interface
• Bus Driver Logic Level Adaptation
• Bus Driver Remote Wakeup
Quality
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
www.onsemi.com
SSOP−16
DP SUFFIX
CASE 565AE
MARKING DIAGRAM
16 16
NV7381−0
AWLYYWW
G
NV7381A0
AWLYYWW
G
11
A = Assembly Location
WL = Wafer Lot
YYWW = Year / Work Week
G = Pb−Free Package
INH
EN
VIO
TxD
TxEN
RxD
BGE
STBN
PIN CONNECTIONS
1
VCC
BP
BM
GND
WAKE
VBAT
ERRN
RxEN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 23 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 3
1
Publication Order Number:
NCV7381/D
1 page  
STBN
EN
Normal
Mode
Receive−Only
Mode
NCV7381
Standby
Mode
Go−to−sleep
Mode
Sleep
Mode
Normal
Mode
ERRN Error Flag
Error Flag
Wake Flag
Wake Flag
Error Flag
dGo−to−sleep
dBDModeChange
dBDModeChange dBDModeChange
dBDModeChange
Figure 4. Timing Diagram of Operating Modes Control by the STBN and EN Pins
Power Supplies and Power Supply Monitoring
NCV7381 is supplied by three pins. VBAT is the main
supply both for NCV7381 and the full electronic module.
VBAT will be typically connected to the automobile battery
through a reverse−polarity protection. VCC is a 5 V
low−voltage supply primarily powering the FlexRay bus
driver core in a normal−power mode. VIO supply serves to
adapt the logical levels of NCV7381 to the host and/or the
FlexRay communication controller digital signal levels. All
supplies should be properly decoupled by filtering
capacitors − see Figure 2 and Table 2.
All three supplies are monitored by under−voltage
detectors with individual thresholds and filtering times both
for under−voltage detection and recovery – see Table 18.
Logic Level Adaptation
Level shift input VIO is used to apply a reference voltage
uVDIG = uVIO to all digital inputs and outputs in order to
adapt the logical levels of NCV7381 to the host and/or the
FlexRay communication controller digital signal levels
www.onsemi.com
5
5 Page 
NCV7381
Table 8. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min Max Units
uVBAT−MAX
uVCC−MAX
uVIO−MAX
uDigInMAX
uDigOutMAX
iDigOutIN−MAX
uBMMAX
uBPMAX
uINHMAX
iINHMAX
uWAKEMAX
TJ_MAX
TSTG
MSL
Battery voltage power supply
5 V Supply voltage
Supply voltage for VIO voltage level adaptation
DC voltage at digital inputs (BGE, EN, STBN, TXD, TXEN)
DC voltage at digital outputs (ERRN, RxD, RxEN)
Digital output pins input current (VIO = 0 V)
DC voltage at pin BM
DC voltage at pin BP
DC voltage at pin INH
INH pin maximum load current
DC voltage at WAKE pin
Junction temperature
Storage Temperature Range
Moisture Sensitivity Level
−0.3
−0.3
−0.3
−0.3
−0.3
−10
−50
−50
−0.3
−10
−0.3
−40
−55
50
5.5
5.5
5.5
VIO+0.3
+10
50
50
VBAT+0.3
−
VBAT+0.3
175
150
2
V
V
V
V
V
mA
V
V
V
mA
V
°C
°C
−
uESDIEC
uESDEXT
System HBM on pins BP and BM (as per IEC 61000−4−2; 150 pF / 330 W)
Component HBM on pins BP, BM, VBAT and WAKE
(as per EIA−JESD22−A114−B; 100 pF / 1500 W)
−10
−6
+10 kV
+6 kV
uESDINT
Component HBM on all other pins
(as per EIA−JESD22−A114−B; 100 pF / 1500 W)
−4 +4 kV
uVTRAN
Voltage transients, pins BP, BM, VBAT and WAKE.
According to ISO7637−2, Class C (Note 4)
test pulses 1
test pulses 2a
−100
−
−V
+75 V
test pulses 3a
−150
−V
test pulses 3b
−
+100
V
Voltage transients, pin VBAT.
According to ISO7637−2
test pulse 5
Load Dump
−
50 V
Overvoltage, pin VBAT, according to ISO16750−2
Jump Start
−
50 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
4. Test is carried out according to setup in FlexRay Physical Layer EMC Measurement Specification, Version 3.0. This specification is referring
to ISO7637. Test for higher voltages is planned.
Table 9. OPERATING RANGES
Symbol
Parameter
Min Max Units
uVBAT−OP
Battery voltage power supply (Note 5)
5.5 50 V
uVCC−OP
Supply voltage 5 V
4.75 5.25 V
uVIO−OP
Supply voltage for VIO voltage level adaptation
2.3 5.25 V
uWAKEOP
DC voltage at WAKE pin
0
VBAT
V
uDigIOOP
DC voltage at digital pins (EN, TXD, TXEN, RXD, RXEN, BGE, STBN, ERRN)
0
VIO V
uBMOP
DC voltage at pin BM
−50 50 V
uBPOP
DC voltage at pin BP
−50 50 V
uINHOP
DC voltage at pin INH
0
VBAT
V
TAMB
Ambient temperature (Note 6)
−40 125 °C
TJ_OP
Junction temperature
−40 150 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
5. Full functionality is guaranteed from 5.1 V. See also parameter uBDUVVBAT.
6. The specified range corresponds to TAMB_Class1
www.onsemi.com
11
11 Page | ||
| Páginas | Total 23 Páginas | |
| PDF Descargar | [ Datasheet NCV7381.PDF ] | |
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