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PDF BC53PA Data sheet ( Hoja de datos )
| Número de pieza | BC53PA | |
| Descripción | 1A PNP medium power transistors | |
| Fabricantes | NXP Semiconductors | |
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BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
Rev. 9 — 19 October 2011
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP53
SOT223
BCX53
SOT89
BC53PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
NPN complement
BCP56
BCX56
BC56PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
ICM
Quick reference data
Parameter
Conditions
collector-emitter voltage open base
collector current
peak collector current single pulse; tp 1 ms
Min Typ Max Unit
- - 80 V
- - 1 A
- - 2 A
1 page  
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
1.5
Ptot
(W)
1.0
0.5
(1)
(2)
(3)
006aac674
1.5
Ptot
(W)
1.0
(1)
(2)
(3)
0.5
006aac675
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
2.0
Ptot
(W)
1.5
1.0
0.5
(1)
(2)
(3)
(4)
(5)
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 2. Power derating curves SOT89
006aac676
0.0
–75
–25
25
75
(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2
(2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
(3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig 3. Power derating curves SOT1061
125 175
Tamb (°C)
BCP53_BCX53_BC53PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 19 October 2011
© NXP B.V. 2011. All rights reserved.
5 of 22
5 Page 
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
006aac685
10
0.02
0.01
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
0.02
10
0.01
006aac686
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, 4-layer copper, standard footprint
Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP53_BCX53_BC53PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 19 October 2011
© NXP B.V. 2011. All rights reserved.
11 of 22
11 Page | ||
| Páginas | Total 22 Páginas | |
| PDF Descargar | [ Datasheet BC53PA.PDF ] | |
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