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PDF LXES15AAA1-133 Data sheet ( Hoja de datos )
| Número de pieza | LXES15AAA1-133 | |
| Descripción | Ceramic ESD Protection Device | |
| Fabricantes | MURATA | |
| Logotipo |  |
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Ceramic ESD Protection Device LXES**A series
Document No. LX–1-1111
Rev1.0
1. This specification shall be applied to the ESD Protection Device.
LXES15AAA1-133
LXES15AAA1-153
LXES03AAA1-154
2. Part Number Configuration
LXES 15 A AA 1 – 133
① ②③④⑤⑥
① Product ID （LXES = ESD Protection device）
② Dimension Code
Unit : mm
Code Dimension
03 0.6 x 0.3
15 1.0 x 0.5
③ Type (A:Ceramic ESD)
④ Control Code
⑤ Number of channel
⑥ Serial Number
※RoHS Compliant
Halogen free
T/R only.
MSL 1
p1/17
MURATA MFG. CO., LTD.
1 page  
5. Reliability Test
No. Items
1 Vibration Resistance
2 Shock
3 Deflection
4
Soldering strength
(Push Strength)
p5/17
S p ec if ic at ions
No severe damages
S atis f y
dimension
s p ec if ic ations
Test Methods
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period
: 2 h on each directionTotal 6 h.
Number
R es ult
(Fail)
22
G
(0)
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock
22
G
(0)
Acceleration : 14,700 m/s2
Period
: 0.3 ms.
C yc le
: 3 times
LXES03A series
2N Minimum
LXES15A series
3N Minimum
Solder specimens on the testing jig (glass epoxy boards)
shown in appended Fig.2 by a Pb free solder. The
soldering shall be done either by iron or reflow and be
conducted with care so that the soldering is uniform and
free of defect such as by heat shock.
No damage with 1.6mm deflection
Solder specimens onto test jig shown below. Apply
pushing force at 0.5mm/s until electrode pads are peeled
off or ceramics are broken. Pushing force is applied to
longitudinal direction.
Pushing Direction
Specimen
Jig
22
22
G
(0)
G
(0)
Immerse specimens first an ethanol solution of rosin,
then in a Pb free solder solution for 3±0.5 sec. at
75% of the
245±5 °C.
5
Solderability of Termination
terminations is to be
soldered evenly and
continuously.
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
22
Appearance
R es is t anc e
No
severe damages
Preheat Temperature : 150-180 °C
Preheat Period
: 90+/ -30 s
to Soldering
High Temperature
: 220 ℃
H eat
High Temp. Period
: 30+/ -10 s
6
(R ef low)
E lec tr ic al
s p ec if ic ations
Satisfy specifications
listed in paragraph
4-2 over operational
temperature range
Peak Temperature
: 260+5/ -0 °C
Specimens are soldered twice with the above condition,
and then kept in room condition for 24 h before
m eas ur e m en ts .
22
G
(0)
G
(0)
MURATA MFG. CO., LTD.
5 Page 
2) LXES15A series
p11/17
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 50 m in thickness
[4] Base tape : As specified in (1)
[5] Bottom tape : 50 m in thickness
[3]
[1]
[2]
[3]
[4]
[5]
Feeding Hole
Feeding Direction
Chip
MURATA MFG. CO., LTD.
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet LXES15AAA1-133.PDF ] | |
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