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Número de pieza | AD274 | |
Descripción | E-pHEMT MMIC | |
Fabricantes | RFHIC | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de AD274 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! E-pHEMT MMIC
AD274
Product Features
• 2-Way Splitter
• 30MHz-1200MHz
• Small size (3X3 mm)
• QFN SMD Type package
• Higher productivity
• Lower manufacturing cost
• -57dBc CSO 135 Channels @ +15dBmV/ch
• -62dBc CTB 135 Channels @ +15dBmV/ch
• -66dBc XMD 135 Channels @ +15dBmV/ch
• 3.5dB Typical Noise Figure
• 75ohm input and outputs
Applications
• Multi Tuner Set-Top Boxes
• Home Gateways
• FTTx (G-PON, GE-PON)
Package Type : QFN 3X3
Description
AD274 is designed as low cost Active Divider for many applications including FTTH, CATV System.
This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise.
The data in this spec sheet is valid only for 75ohm application.
Electrical Specifications
PARAMETER
UNIT
MIN
TYP
Frequency
MHz
30 ~ 1000
Gain
dB 4.5 5.5
Gain Flatness
dB
1.4
Input Return Loss
dB - -16
Output Return Loss
dB - -20
IN&OUT Port Isolation
dB - -30
OUT&OUT Port Isolation
dB - -20
Output IP3
dBm 22
26
1dB Compression Point
dBm 8
12
Noise Figure
dB - 3.5
CSO
50 ~ 870MHz
dBc -
-57
CTB
135 channel@
dBc -
-62
XMOD
Input Power +15dBmV/ch
dBc
-
-66
DC Current
mA -
110
Supply Voltage
V
5
Note
1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=5V, 75Ω system
2. OIP3 measured with 2 tones at an output power of +0dBm/tone separated by 1MHz, Test Freq = 500MHz
MAX
-
2
-
-
-
-
-
-
4.5
-
-
-
-
Typ
-
4
1.6
-12
-20
-30
-20
18
8
3.3
-51
-58
-56
75
3.3
Absolute Maximum Ratings
PARAMETER
Device Voltage
Operating Case Temperature
Storage Temperature
ESD Human Body Model
Moisture sensitivity Level
Junction temperature
Thermal Resistance (Rth)
Korean Facilities : 82-31-250-5078 / [email protected]
US Facilities : 919-77-8780 / [email protected]
UNIT
VDC
℃
℃
-
-
℃
℃/W
MIN
-
-40
-40
-
-
-
-
1/6
TYP
5
-
-
Class 1A
MSL1
120
70
MAX
5.5
85
150
-
-
180
-
All specifications may change without notice
Version 1.0
1 page E-pHEMT MMIC
AD274
Package Dimensions (Type: QFN3x3)
* Unit: mm[inch] | Tolerance: ±0.2[.008]
▲ Top View
▲ Side View
▲ Bottom View
Pin No
1
2
3
4
Function
NC
GND
GND
Input
Pin No
5
6
7
8
Pin Description
Function Pin No
Bias/Port1
9
NC 10
Port2
11
NC 12
Function
Output-1
GND
GND
Output-2
Pin No
13
14
15
16
Function
NC
NC
NC
NC
* Mounting Configuration Notes
1. Ground / thermal via holes are critical for the proper performance of this device.
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink.
4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink.
5. RF trace width depends upon the PCB material and construction.
6. Use 1 oz. Copper minimum.
Korean Facilities : 82-31-250-5078 / [email protected]
US Facilities : 919-77-8780 / [email protected]
5/6
All specifications may change without notice
Version 1.0
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet AD274.PDF ] |
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