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PDF UT0324-41 Data sheet ( Hoja de datos )
| Número de pieza | UT0324-41 | |
| Descripción | 3.0mm ROUND LED LAMP | |
| Fabricantes | Ledtech | |
| Logotipo |  |
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LEDTECH ELECTRONICS CORP.
USA Sales Office
19209 Parthenia Street - Suite D
Northridge, CA 91324
Phone: (818) 701-7240
Fax: (818) 701-7217
SPECIFICATION
PART NO. : UT0324-41
3.0mm ROUND LED LAMP
Approved by
Tung
Checked by
Yang
Prepared by
Qing
1 page  
UT0324-41
3.0mm ROUND
LED LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1. Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130 .
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1) Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2) Dip soldering :
Pre-heat: 90 max. (Backside of PCB), Within 60 seconds.
Solder bath: 260 5 (Solder temperature), Within 5 seconds.
(3) Hand soldering: 350 max. (Temperature of soldering iron tip), Within 3 seconds.
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120 max. Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01 Date: 2007/01/18 Page: 4/5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet UT0324-41.PDF ] | |
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