|
|
PDF AG201-63 Data sheet ( Hoja de datos )
| Número de pieza | AG201-63 | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de AG201-63 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
|
No Preview Available !
AG201-63
InGaP HBT Gain Block
Product Features
DC – 6000 MHz
In1G1 adPB GHaBinT@G90a0inMBHlzock
+6.5 dBm P1dB @ 900 MHz
+19 dBm OIP3 @ 900 MHz
Single Voltage Supply
Internally matched to 50
Robust 1000V ESD, Class 1C
Lead-free/green/RoHS-compliant
SOT-363 package
Applications
Mobile Infrastructure
CATV / FTTX
WLAN / ISM
RFID
WiMAX / WiBro
Product Description
Functional Diagram
The AG201-63 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG201-63 typically provides
11 dB gain, +19 dBm OIP3, and +6.5 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 1000 years at
mounting temperatures of +85 C and is housed in a lead-
free/green/RoHS-compliant SOT-363 industry standard
SMT package.
The AG201-63 consists of a Darlington-pair amplifier
using the high reliability InGaP/GaAs HBT process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
GND 1
6 RF OUT
GND 2
5 GND
RF IN 3
4 GND
Function
Input
Output/Bias
Ground
Pin No.
3
6
1, 2, 4, 5
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG201-63 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and WiMAX.
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
10
Typ
900
11.3
25
16
+6.5
+19.1
+27
4.4
1900
11
+5.8
+18.5
4.0
20
Max
6000
12
1. Test conditions: T = 25 ºC, Supply Voltage = +5 V, Rbias = 49.9 , 50 System.
2. 3OIP measured with two tones at an output power of -10 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
11.4
-30
-16
+6.5
+19.5
4.3
Typical
900 1900
11.3 11
-25 -20
-16 -16
+6.5 +5.8
+19.1 +18.5
4.4 4.6
2140
10.9
-15
-16
+5.1
+18.2
4.6
Absolute Maximum Rating
Parameter
Storage Temperature
DC Voltage
RF Input Power (continuous)
Thermal Resistance, Rth
For 106 hours MTTF
Junction Temperature
Rating
-55 to +125 C
+4.5 V
+10 dBm
410 C/W
+177 C
Ordering Information
Part No.
AG201-63G
AG201-63PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 Package)
700 – 2400 MHz Fully Assembled Eval. Board
Standard tape / reel size = 3000 pieces on a 7” reel
.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: [email protected] Web site: www.TriQuint.com
Page 1 of 5 August 2009
1 page  
AG201-63
InGaP HBT Gain Block
AG201-63G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
InGaP HBT Gain Block
Outline Drawing
Product Marking
The component will be marked with an “F”
designator followed by a two-digit numeric lot
code on the top surface of the package.
FXX
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1C
Value:
Passes 1000V min.
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V min.
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: [email protected] Web site: www.TriQuint.com
Page 5 of 5 August 2009
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet AG201-63.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AG201-63 | InGaP HBT Gain Block |  ETC |
| AG201-63 | InGaP HBT Gain Block | TriQuint Semiconductor |
| AG201-63PCB | InGaP HBT Gain Block | ETC |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |