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PDF uClamp3671P Data sheet ( Hoja de datos )
| Número de pieza | uClamp3671P | |
| Descripción | High-Power uClamp 1-Line Surge Protection | |
| Fabricantes | Semtech Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de uClamp3671P (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
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uClamp0571P - uClamp3671P
High-Power μClamp®
1-Line Surge Protection
PROTECTION PRODUCTS - MicroClamp®
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to EOS, light-
ning, CDE, and ESD. They feature large cross-sectional
area junctions for conducting high transient currents.
These devices offer desirable characteristics for board
level protection including fast response time, low oper-
ating and clamping voltage, and no device degradation.
The μClamp®xx71P series are in 2-pin SGP1610N2
package measuring 1.6 x 1.0 mm with a nominal
height of 0.57mm. The leads are finished with lead-
free NiPdAu. They may be used to protect 5V, 8V, 10V,
12V, 15V, 18V, 22V, 26V, and 36V systems. They
feature high surge current capability and low clamping
voltage making them ideal for use in harsh transient
environments.
Features
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) 30kV (air), 30kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 20 - 80A (8/20μs)
Protects one data or power line
Low leakage current
High peak pulse current capability
Operating voltage options: 5V, 8V, 10V, 12V, 15V,
18V, 22V, 26V, 36V
Qualified to AEC-Q100
Solid-state silicon-avalanche technology
Mechanical Characteristics
SGP1610N2 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.0 x 0.57 mm
Lead Finish: NiPdAu
Marking: Marking code
Packaging: Tape and Reel
Applications
Cellular Handsets & Accessories
USB Voltage Bus
Battery Protection
Digital Lines
Proximity Sensors
Automotive Applications
Nominal Dimensions
1.60
1.00
Schematic
1
1.10 BSC
0.40
0.57
All Dimensions in mm
Revision 9/25/2014
2
SGP1610N2 (Bottom View)
1 www.semtech.com
1 page  
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
uClamp1871P
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Symbol
VRWM
VBR
Reverse Leakage Current
IR
Peak Pulse Current
IPP
Clamping Voltage
VC
Clamping Voltage
VC
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
Conditions
Pin 1 to 2
It = 1mA
Pin 1 to 2
VRWM = 18V, T=25°C
Pin 1 to 2
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
Pin 1 to 2
IPP
=
35A,
Pin
tp =
1 to
8/20μs
2
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
Minimum
20
Typical
22
<10
0.10
Maximum
18
25
Units
V
V
100 nA
35 A
28 V
45 V
Ohms
225 pF
uClamp2271P
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
Clamping Voltage
Dynamic Resistance3, 4
Junction Capacitance
Symbol
VRWM
VBR
IR
IPP
VC
VC
RDYN
Cj
Conditions
Pin 1 to 2
It = 1mA
Pin 1 to 2
VRWM = 22V, T=25°C
Pin 1 to 2
tp = 8/20μs
Pin 1 to 2
IPP
=
10A,
Pin
tp =
1 to
8/20μs
2
IPP = 25A, tp = 8/20μs
Pin 1 to 2
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
Minimum
25.5
Typical
29
<10
0.10
Maximum
22
33.5
Units
V
V
100 nA
25 A
40 V
55 V
Ohms
165 pF
© 2014 Semtech Corporation
5
www.semtech.com
5 Page 
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The table below provides Semtech's recommended
assembly guidelines for mounting this device. The
figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
The exact manufacturing parameters will require some
experimentation to get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.125 mm (0.005")
Type 3 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Stencil Opening
Land Pad ( Follow drawing )
1.600
0.700
1.000
1.025
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
© 2014 Semtech Corporation
11
www.semtech.com
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet uClamp3671P.PDF ] | |
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