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PDF LV5684PVD Data sheet ( Hoja de datos )
| Número de pieza | LV5684PVD | |
| Descripción | Multi-Power Supply IC | |
| Fabricantes | ON Semiconductor | |
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Ordering number : ENA2141
LV5684PVD
Bi-CMOS LSI
For Car Audio Systems
Multi-Power Supply IC
Overview
The LV5684PVD is a power supply IC suitable for USB/CD receiver system for car audio system.
This IC integrates 5 systems of regulator output, 2 systems of high side power switch, overcurrent protector,
overvoltage protector and overheat protector
Supply for VDD and SW33V outputs is low voltage specification, which enables drastic reduction of power dissipation
compared to the existing model. (the package is HZIP15).
Features
• Low consumption current: 50μA (typ, only VDD output is in operation)
• 5 systems of regulator output
VDD for microcontroller: output voltage: 3.3V, maximum output current: 350mA reverse current protection
implemented.
For system: output voltage: 3.3V, maximum output current: 450mA
For audio: output voltage: 5 to 9V (set by external resistors), maximum output current: 250mA
For illumination: output voltage: 5 to 12V (set by external resistors), maximum output current: 300mA
For CD: output voltage: 5V/8V, maximum output current: 1300mA
• 2 lines of high side switch with interlock VCC
EXT: Maximum output current: 350mA, voltage difference between input and output: 0.5V
ANT: Maximum output current: 300mA, voltage difference between input and output: 0.5V
• Supply input
V6IN: 6V for VDD, system (SW33V)
VCC1: For internal reference voltage, control circuits
In case of voltage drop of V6IN, VCC1 supplies to VDD output.
VCC2: For AUDIO, illumination, CD, EXT/ANT
• Overcurrent protector
• Overvoltage protector(OVP): VCC1,VCC2 Typ 23V (All outputs except VDD are turned off)
Overvoltage shutdown(OVS): V6IN Typ 23V (All outputs except VDD are turned off)
• Overheat protector: Typ 175°C
Continued on next page.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer's products or
equipment.
O1712NK 20120920-S00003 No.A2141-1/12
1 page  
Package Dimensions
unit : mm (typ)
3336
(R1.75)
21.6
(20.0)
(11.0)
HEAT SPREADER
LV5684PVD
• Allowable power dissipation derating curve
Pd max -- Ta
8 Aluminum heat sink mounting conditions
tightening torque : 39N×cm, using silicone grease
3.0 7
6
Aluminum heat sink (50 × 50 × 1.5mm3) when using
5.3
5
4
1
(1.91)
1.27
15
0.7
0.4
2.54 2.54
SANYO : HZIP15
3
2
Independent IC (HZIP15)
1.3
1
0
--40 --20
0 20 40 60 80 100 120 140150160
Ambient temperature, Ta -- °C
Application Circuit Example
LV5684PVD
2 4 6 8 10 12 14
1 3 5 7 9 11 13 15
C15 C16
R1 R3
+ ++
C2
C1 R2 C3
C4
R4
CTRL2
C5
CTRL1
C12 C11 C13 C14
+
C7 C8
+
C9 C10 V6IN VDD SW33V
D2 D4
D1 D3
ILM
CD
AUDIO
VCC2
VCC1
ANT
EXT
Peripheral parts
Part name
Description
Recommended value
Note
C1, C3, C5, C13, C14
output stabilization capacitor
greater than10μF (*1)
C2, C4
output stabilization capacitor
0pF Ceramic capacitor
C8, C10, C12
C7, C9, C11
Capacitor for bypass power supply
Capacitor for oscillation protector
C8: greater than 100μF
C10,C12: greater than 47μF
greater than 0.22μF
Make sure to implement close to
VCC and GND.
C15, C16
Capacitor for EXT/ANT output stabilization
greater than 2.2μF
R1, R2
ILM voltage setting
R3, R4
D1, D2, D3, D4
AUDIO voltage setting
Internal device protector diode
R1/R2
43kΩ/5.1kΩ : VO = 12V
56kΩ/7.5kΩ : VO = 10.5V
30kΩ/5.6kΩ : VO = 8V
30kΩ/10kΩ : VO = 5V
R3/R4
30kΩ/10kΩ : VO = 5V
30kΩ/5.6kΩ : VO = 8.0V
27kΩ/4.7kΩ : VO = 8.5V
24kΩ/3.9kΩ : VO = 9V
SANYO SB1003M3
Use resistors of tolerance within 1%
Use resistors of tolerance within 1%
(*1) Make sure that output capacitors are greater than 10uF and meets the condition of ESR = 0.001 to 10Ω , in which voltage/ temperature dependence and
unit differences are taken into consideration. Moreover, in case of electrolytic capacitor, high-frequency characteristics should be sufficiently good.
No.A2141-5/12
5 Page 
HZIP15 Heat sink attachment
LV5684PVD
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b. Heat sink attachment
• Use flat-head screws to attach heat sinks.
• Use also washer to protect the package.
• Use tightening torques in the ranges 39-59Ncm (4-6kgcm) .
• If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
• Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Take care a position of via hole .
• Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Verify that there are no press burrs or screw-hole burrs on the heat sink.
• Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
• Twisting must be limited to under 0.05 mm.
• Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
• The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Heat sink
gap
Via hole
Countersunk head
mashine screw
c. Silicone grease
• Spread the silicone grease evenly when mounting heat sinks.
• Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d. Mount
• First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
• When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e. When mounting the semiconductor device to the heat sink using jigs, etc.,
• Take care not to allow the device to ride onto the jig or positioning dowel.
• Design the jig so that no unreasonable mechanical stress is applied to the semiconductor device.
f. Heat sink screw holes
• Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
• When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
• When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2141-11/12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LV5684PVD.PDF ] | |
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