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PDF BMM150 Data sheet ( Hoja de datos )

Número de pieza BMM150
Descripción Geomagnetic Sensor
Fabricantes Bosch 
Logotipo Bosch Logotipo



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Data sheet
BMM150
Geomagnetic Sensor
Bosch Sensortec
BMM150: Data sheet
Document revision
Document release date
Document number
Technical reference code(s)
Notes
1.0
April 25th , 2013
BST-BMM150-DS001-01
0 273 141 157
Data in this document are preliminary and subject to change without
notice. Product photos and pictures are for illustration purposes only and
may differ from the real product’s appearance.
Advance information - Subject to change without notice

1 page




BMM150 pdf
Datasheet
BMM150 Geomagnetic Sensor
Page 5
6. DIGITAL INTERFACES............................................................................................................32
6.1 SERIAL PERIPHERAL INTERFACE (SPI)................................................................................ 33
6.2 INTER-INTEGRATED CIRCUIT (I²C) ...................................................................................... 36
7. PIN-OUT AND CONNECTION DIAGRAM...............................................................................41
7.1 PIN-OUT ........................................................................................................................... 41
7.2 CONNECTION DIAGRAM 4-WIRE SPI ................................................................................... 42
7.3 CONNECTION DIAGRAM 3-WIRE SPI ................................................................................... 43
7.4 CONNECTION DIAGRAM I2C................................................................................................ 44
8. PACKAGE ................................................................................................................................45
8.1 OUTLINE DIMENSIONS ....................................................................................................... 45
8.2 SENSING AXES ORIENTATION ............................................................................................. 46
9. SENSOR ORIENTATION .........................................................................................................46
9.1 ANDROID AXES ORIENTATION............................................................................................. 47
9.2 LANDING PATTERN RECOMMENDATION ............................................................................... 48
9.3 MARKING.......................................................................................................................... 49
9.3.1 MASS PRODUCTION DEVICES ........................................................................................................ 49
9.3.2 ENGINEERING SAMPLES................................................................................................................ 50
9.4 SOLDERING GUIDELINES .................................................................................................... 51
9.5 HANDLING INSTRUCTIONS.................................................................................................. 52
9.5.1 TAPE AND REEL DIMENSIONS......................................................................................................... 53
9.5.2 ORIENTATION WITHIN THE REEL..................................................................................................... 53
9.6 ENVIRONMENTAL SAFETY .................................................................................................. 54
9.6.1 HALOGEN CONTENT ..................................................................................................................... 54
9.6.2 INTERNAL PACKAGE STRUCTURE ................................................................................................... 54
10. LEGAL DISCLAIMER.............................................................................................................55
10.1 ENGINEERING SAMPLES................................................................................................... 55
10.2 PRODUCT USE ................................................................................................................ 55
10.3 APPLICATION EXAMPLES AND HINTS ................................................................................. 55
11. DOCUMENT HISTORY AND MODIFICATION .....................................................................56
BST-BMM150-DS001-01 | Revision 1.0 | April 2013
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

5 Page





BMM150 arduino
Datasheet
BMM150 Geomagnetic Sensor
Page 11
4. Functional description
BMM150 is a triaxial standalone geomagnetic sensor (Sensing element and ASIC) in chip scale
wafer level package and can be operated via I2C or SPI as a slave device.
4.1 Power management
The BMM150 has two distinct power supply pins:
• VDD is the main power supply for all internal analog and digital functional blocks;
• VDDIO is a separate power supply pin, used for the supply of the digital interface as well as the
digital logic.
The device can be completely switched off (VDD = 0V) while keeping the VDDIO supply on (VDDIO >
0V) or vice versa.
It is absolutely prohibited to keep any interface at a logical high level when VDDIO is switched off.
Such a configuration will permanently damage the device (i.e. if VDDIO = 0 [SDI & SDO & SCK
& CSB] high).
The device contains a power on reset (POR) generator. It resets the logic part and the register
values of the concerned ASIC after powering-on VDD and VDDIO. Please note, that all application
specific settings which are not equal to the default settings (refer to register maps in chapter
5.2), must be re-set to its designated values after POR.
In case the I²C interface is used, a direct electrical connection between VDDIO supply and the PS
pin is recommended in order to ensure reliable protocol selection.
4.2 Power modes
The BMM150 features configurable power modes. The BMM150 magnetometer part has four
power modes:In the following chapters, power modes are described.
4.2.1 Power off mode
In Power off mode, VDD and/or VDDIO are unpowered and the device does not operate. When
only one of VDD or VDDIO is supplied, the magnetic sensor will still be in Power off mode. Power
on reset is performed after both VDD and VDDIO raised above their detection thresholds.
4.2.2 Suspend mode
Suspend mode is the default power mode of BMM150 after the chip is powered. When VDD and
VDDIO are turned on the POR (power on reset) circuits operate and the device’s registers are
initialized. After POR becomes inactive, a start up sequence is executed. In this sequence NVM
content is downloaded to shadow registers located in the device core. After the start up
sequence the device is put in the Suspend mode. In this mode only registers which store power
control bit information and SPI3 wire enable can be accessed by the user. No other registers
can be accessed in Suspend mode. All registers lose their content, except the control register
(0x4B). In particular, in this mode a Chip ID read (register 0x40) returns “0x00” (I²C) or high-Z
(SPI).
BST-BMM150-DS001-01 | Revision 1.0 | April 2013
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

11 Page







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