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PDF KLMCG8WE4A-A001 Data sheet ( Hoja de datos )
| Número de pieza | KLMCG8WE4A-A001 | |
| Descripción | embedded MMC solution | |
| Fabricantes | Samsung | |
| Logotipo |  |
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SAMSUNG CONFIDENTIAL
Rev. 1.1, Jul. 2012
KLMxGxxE4x-x001
Samsung e·MMC Product family
e.MMC 4.41 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.
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1 page  
KLMxGxxE4x-x001
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.1
e·MMC
Table Of Contents
1.0 PRODUCT LIST..........................................................................................................................................................6
2.0 KEY FEATURES.........................................................................................................................................................6
3.0 PACKAGE CONFIGURATIONS .................................................................................................................................7
3.1 153 Ball Pin Configuration ....................................................................................................................................... 7
3.2 169 Ball Pin Configuration ....................................................................................................................................... 8
3.2.1 11.5mm x 13mm x 1.0mm Package Dimension................................................................................................ 9
3.2.2 12mm x 16mm x 1.0mm Package Dimension................................................................................................... 9
3.2.3 12mm x 16mm x 1.2mm Package Dimension................................................................................................... 10
3.3 Product Architecture ................................................................................................................................................ 11
4.0 e.MMC 4.41 features ..................................................................................................................................................12
4.1 Data Write................................................................................................................................................................ 12
4.2 Reliable Write .......................................................................................................................................................... 13
4.3 Secure Trim ............................................................................................................................................................. 13
4.4 High Priority Interrupt............................................................................................................................................... 13
4.5 Background Operation............................................................................................................................................. 15
5.0 Technical Notes ..........................................................................................................................................................16
5.1 S/W Agorithm .......................................................................................................................................................... 16
5.1.1 Partition Management ....................................................................................................................................... 16
5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................ 16
5.1.1.2 Enhanced Partition (Area) .......................................................................................................................... 16
5.1.2 Write protect management ................................................................................................................................ 17
5.1.2.1 User Area Write Protection ......................................................................................................................... 17
5.1.2.2 Boot Partition Write Protection.................................................................................................................... 17
5.1.3 Boot operation................................................................................................................................................... 18
5.1.4 User Density...................................................................................................................................................... 19
5.1.5 Auto Power Saving Mode.................................................................................................................................. 20
5.1.6 Performance...................................................................................................................................................... 20
6.0 REGISTER VALUE .....................................................................................................................................................21
6.1 OCR Register .......................................................................................................................................................... 21
6.2 CID Register ............................................................................................................................................................ 21
6.2.1 Product name table (In CID Register) ............................................................................................................... 21
6.3 CSD Register........................................................................................................................................................... 22
6.4 Extended CSD Register .......................................................................................................................................... 23
7.0 AC PARAMETER........................................................................................................................................................26
7.1 Time Parameter ....................................................................................................................................................... 26
7.2 Bus Timing Parameter ............................................................................................................................................. 26
7.3 Bus timing for DAT signals during 2x data rate operation ....................................................................................... 28
7.3.1 Dual data rate interface timings ........................................................................................................................ 28
7.4 Bus signal levels ...................................................................................................................................................... 29
7.4.1 Open-drain mode bus signal level..................................................................................................................... 29
7.4.2 Push-pull mode bus signal level.high-voltage MultiMediaCard ......................................................................... 29
7.4.3 Push-pull mode bus signal level.dual-voltage MultiMediaCard ......................................................................... 29
7.4.4 Push-pull mode bus signal level.e·MMC ........................................................................................................... 30
8.0 DC PARAMETER .......................................................................................................................................................31
8.1 Active Power Consumption during operation .......................................................................................................... 31
8.2 Standby Power Consumption in auto power saving mode and standby state........................................................ 31
8.3 Sleep Power Consumption in Sleep State.............................................................................................................. 31
8.4 Supply Voltage ........................................................................................................................................................ 31
8.5 Bus Operating Conditions........................................................................................................................................ 31
8.6 Bus Signal Line Load............................................................................................................................................... 32
9.0 e·MMC Connection Guide ..........................................................................................................................................33
9.1 x8 support Host connection Guide .......................................................................................................................... 33
9.2 x4 support Host connection Guide .......................................................................................................................... 33
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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5 Page 
KLMxGxxE4x-x001
datasheet
3.3 Product Architecture
- e·MMC consists of NAND Flash and Controller. VDD is for Controller power and VDDF is for flash power
VDDF
SAMSUNG CONFIDENTIAL
Rev. 1.1
e·MMC
VDD
RESET
CReg
CLK
CMD
DAT[7:0]
Core Regulator
(Required for 3.3V VDD)
VDDi
LCoogriec
Block
MMC Controller
Control Signal
Data Bus
Memory
Figure 6. e·MMC Block Diagram
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
- 11 -
11 Page | ||
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| PDF Descargar | [ Datasheet KLMCG8WE4A-A001.PDF ] | |
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