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PDF ADNS-7530 Data sheet ( Hoja de datos )
| Número de pieza | ADNS-7530 | |
| Descripción | Integrated molded lead-frame DIP Sensor | |
| Fabricantes | PixArt | |
| Logotipo |  |
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Data Sheet
ADNS-7530
Integrated molded lead-frame DIP Sensor
Theory of Operation
The ADNS-7530 integrated molded lead-frame DIP
sensor comprises of sensor and VCSEL in a single
package.
The advanced class of VCSEL was engineered by PixArt
Imaging to provide a laser diode with a single lon-
gitudinal and a single transverse mode. In contrast to
most oxide-based single-mode VCSEL, this class of PixArt
VCSEL remains within single mode operation over a wide
range of output power. It has significantly lower power
consumption than a LED. It is an excellent choice for
optical navigation applications.
The sensor is based on Laser technology, which
measures changes in position by optically acquiring se-
quential surface images (frames) and mathematically
determining the direction and magnitude of movement.
It contains an Image Acquisition System (IAS), a Digital
Signal Processor (DSP), and a four wire serial port. The IAS
acquires microscopic surface images via the lens and il-
lumination system. These images are processed by the
DSP to determine the direction and distance of motion.
The DSP calculates the Δx and Δy relative displacement
values. An external microcontroller reads the Δx and Δy
information from the sensor serial port. The microcon-
troller then translates the data into PS2, USB, or RF signals
before sending them to the host PC or game console.
Features
• Wide operating voltage: 2.7V-3.6V
• Small form factor, integrated molded lead frame DIP
package
• Low power architecture
• Laser Technology
• Self-adjusting power-saving modes for longest battery
life
• High speed motion detection up to 30 ips and 8g
• Enhanced SmartSpeed self-adjusting frame rate for
optimum performance
• Motion detect pin output
• 12-bits motion data registers.
• Internal oscillator – no clock input needed.
• Selectable 400, 800, 1200, 1600, 2000 cpi resolution.
• Four wire serial port
• Minimal number of passive components
• Laser fault detect circuitry on-chip for Eye Safety
Compliance
• Advanced Technology VCSEL chip
• Single Mode Lasing operation
• 832-865 nm wavelength
Applications
• Laser Mice
• Optical trackballs
• Integrated input devices
• Battery-powered input devices
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: [email protected]
1
1 page  
PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Assembly Recommendation
1. Insert the integrated molded lead-frame DIP
sensor and all other electrical components into the
application PCB.
2. This sensor package is only qualified for wave-solder
process.
3. Wave-solder the entire assembly in a no-wash solder
process utilizing a solder fixture. The solder fixture
is needed to protect the sensor during the solder
process. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
4. Place the lens onto the base plate. Care must be taken
to avoid contamination on the optical surfaces.
5. Remove the protective kapton tapes from the optical
aperture of the sensor and VCSEL respectively. Care
must be taken to keep contaminants from entering
the aperture.
6. Insert the PCB assembly over the lens onto the base
plate. The sensor package should self-align to the lens.
The optical position reference for the PCB is set by the
base plate and lens. The alignment guide post of the
lens locks the lens and integrated molded lead-frame
DIP sensor together. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
7. Optional: The lens can be permanently locked to the
sensor package by melting the lens’ guide posts over
the sensor with heat staking process.
8. Tune the laser output power from the VCSEL to meet
the Eye Safe Class I Standard as detailed in the LASER
Power Adjustment Procedure.
9. Install the mouse top case. There must be a feature in
the top case (or other area) to press down onto the
sensor to ensure the sensor and lenses are interlocked
to the correct vertical height.
Design considerations for improving ESD Performance
For improved electrostatic discharge performance,
typical creepage and clearance distance are shown in
the table below. Assumption: base plate construction as
per the PixArt supplied IGES file and ADNS-6150, ADNS-
6160-001 or ADNS-6170-002 lens:
Lens ADNS-6150 ADNS-6160-001 ADNS-6170-002
Creepage 12.0 mm 13.50 mm
20.30 mm
Clearance 2.1 mm
1.28 mm
1.28 mm
Note that the lens material is polycarbonate and
therefore, cyanoacrylate based adhesives or other
adhesives that may damage the lens should NOT be
used.
14.18
0.558
7X 1.78
0.070
3.18 Lens interference 2.31
0.125 0.091
(2.78)
0.110
0 Pin #1
0
Optical center
0.89
0.035
13.35
0.526
∅ 1.10
0.043
16X ∅ 0.70
0.028
Pad ring
Figure 5. Recommended PCB mechanical cutouts and spacing
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
5 Page 
PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Optical/Electrical Characteristics (at Tc = 5°C to 45°C):
VCSEL Die Source Marking
V = A,V
V=C
Parameter
Symbol Min Typ Max Min Typ Max Units Notes
Peak Wavelength
λ 832
865 832
865 nm
Maximum Radiant
Power
LOPmax
4.5
4.0 mW Maximum output power under
any condition. This is not a rec-
ommended operating condition
and does not meet eye safety
requirements.
Wavelength Temperature dλ/dT
Coefficient
0.065
0.065
nm/
ºC
Wavelength Current
Coefficient
dλ/dI
0.21
0.3 nm/
mA
Beam Divergence
θFW@1/
e^2
15
16 deg
Threshold Current
Slope Efficiency
Ith
SE
4.2
0.4
3.0 mA
0.35 W/A
Forward Voltage
VF
2.1 2.4
2.1 2.4 V At 500uW output power
Notes:
1. VCSELs are sorted into bins as specified in the power adjustment procedure. Appropriate binning register data values are used in the application
circuit to achieve the target output power. The VCSEL binning is marked on the integrated molded lead-frame DIP sensor package.
2. When driven with current or temperature range greater than specified in the power adjustment procedure section, eye safety limits may be
exceeded. The VCSEL should then be treated as a Class IIIb laser and as a potential eye hazard.
3. Over driving beyond LOPmax limit will cause the VCSEL to enter into an unstable region. Any LOP that exceeds this limit should not be taken as a
valid reference point in the laser power calibration process.
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: [email protected]
11
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| PDF Descargar | [ Datasheet ADNS-7530.PDF ] | |
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